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STA333ML Datasheet(PDF) 11 Page - STMicroelectronics |
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STA333ML Datasheet(HTML) 11 Page - STMicroelectronics |
11 / 14 page STA333ML Package information 11/14 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 7. PowerSSO-36 slug down dimensions Symbol mm inch Min Typ Max Min Typ Max A 2.15 - 2.47 0.085 - 0.097 A2 2.15 - 2.40 0.085 - 0.094 a1 0 - 0.10 0 - 0.004 b 0.18 - 0.36 0.007 - 0.014 c 0.23 - 0.32 0.009 - 0.013 D 10.10 - 10.50 0.398 - 0.413 E 7.40 - 7.60 0.291 - 0.299 e - 0.5 - - 0.020 e3 - 8.5 - - 0.335 F - 2.3 - - 0.091 G- - 0.10 - - 0.004 H 10.10 - 10.50 0.398 0.413 h- - 0.40 0.016 k 0 - 8 degrees 8 degrees L 0.60 - 1.00 0.024 0.039 M - 4.30 - 0.169 N - - 10 degrees 10 degrees O - 1.20 - 0.047 Q - 0.80 - 0.031 S - 2.90 - 0.114 T - 3.65 - 0.144 U - 1.00 - 0.039 X 4.10 4.70 0.161 0.185 Y 6.50 7.10 0.256 0.280 |
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