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AMIS-42670NGA Datasheet(PDF) 5 Page - AMI SEMICONDUCTOR |
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AMIS-42670NGA Datasheet(HTML) 5 Page - AMI SEMICONDUCTOR |
5 / 12 page AMIS-42670 High-Speed CAN Transceiver Data Sheet For Long Networks 8.0 Electrical Characteristics 8.1 Definitions All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means the current is flowing into the pin; sourcing current means the current is flowing out of the pin. 8.2 Absolute Maximum Ratings Stresses above those listed in the following table may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may affect device reliability. Table 4: Absolute Maximum Ratings Symbol Parameter Conditions Min. Max. Unit VCC Supply voltage -0.3 +7 V VCANH DC voltage at pin CANH 0 < VCC < 5.25V; no time limit -45 +45 V VCANL DC voltage at pin CANL 0 < VCC < 5.25V; no time limit -45 +45 V VTxD DC voltage at pin TxD -0.3 VCC + 0.3 V VRxD DC voltage at pin RxD -0.3 VCC + 0.3 V VS DC voltage at pin S -0.3 VCC + 0.3 V VREF DC voltage at pin VREF -0.3 VCC + 0.3 V Vtran(CANH) Transient voltage at pin CANH Note 1 -150 +150 V Vtran(CANL) Transient voltage at pin CANL Note 1 -150 +150 V Vesd Electrostatic discharge voltage at all pins Note 2 Note 4 -4 -750 +4 +750 kV V Latch-up Static latch-up at all pins Note 3 100 mA Tstg Storage temperature -55 +155 °C Tamb Ambient temperature -40 +125 °C Tjunc Maximum junction temperature -40 +150 °C Notes: 1. Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b (see Figure 4). 2. Standardized human body model ESD pulses in accordance to MIL883 method 3015.7. 3. Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78. 4. Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993. 8.3 Thermal Characteristics Table 5: Thermal Characteristics Symbol Parameter Conditions Value Unit Rth(vj-a) Thermal resistance from junction to ambient in SO8 package In free air 150 K/W Rth(vj-s) Thermal resistance from junction to substrate of bare die In free air 45 K/W 5 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice |
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