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TN12 Datasheet(PDF) 10 Page - STMicroelectronics |
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TN12 Datasheet(HTML) 10 Page - STMicroelectronics |
10 / 12 page Package information TN12, TS12 and TYNx12 Series 10/12 Figure 19. D2PAK footprint dimensions (in millimeters) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 9. D2PAK dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.25 1.40 0.048 0.055 C 0.45 0.60 0.017 0.024 C2 1.21 1.36 0.047 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.28 0.393 0.405 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 R 0.40 0.016 V2 0° 8° 0° 8° G L L3 L2 B B2 E 2mm min. FLAT ZONE A C2 D R A2 V2 C A1 16.90 10.30 8.90 3.70 5.08 1.30 |
Similar Part No. - TN12_07 |
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Similar Description - TN12_07 |
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