LFTVS18-1F3

Package information

5/7

3

Package information

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

Figure 14.

Flip chip dimensions

Figure 15.

Footprint recommendations

Figure 16.

Marking

185 µm ± 10

0.77 mm ± 30 µm

255 µm ± 40

205 µm ± 40

400 µm ± 40

605 µm ± 55

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:

300 µm minimum

x

y

x

w

z

w

Dot

xx = marking

yww = datecode

(y = year

ww = week)

z = manufacturing location