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HCF4093 Datasheet(PDF) 9 Page - STMicroelectronics |
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HCF4093 Datasheet(HTML) 9 Page - STMicroelectronics |
9 / 13 page HCF4093 Package mechanical data 9/13 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 5. Plastic DIP-14 package outline 1. Drawing not to scale. Table 8. Plastic DIP-14 mechanical data Symbol millimeters inches Min Typ Max Min Typ Max a1 0.51 0.020 B 1.39 1.65 0.055 0.065 b0.5 0.020 b1 0.25 0.010 D20 0.787 E8.5 0.335 e 2.54 0.100 e3 15.24 0.600 F 7.1 0.280 I 5.1 0.201 L3.3 0.130 Z 1.27 2.54 0.050 0.100 P001A |
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