EMIF06-VID01F2

Package information

5/7

Figure 12.

Flip Chip tape and reel specification

Note:

More packing information is available in the application note

AN1235: “Flip Chip: Package description and recommendations for use”

AN1751: “EMI Filters: Recommendations and measurements”

Figure 10.

Footprint recommendations

Figure 11.

Marking

Copper pad diameter:

250 µm recommended, 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 300 µm copper pad diameter

Dot, ST logo

xx = marking

yww = date code

(y = year

ww = week)

z = manufacturing location

x

y

z

w

x

w

E

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 ± 0.1

1.52

4 ± 0.1

Ø 1.5 ± 0.1

0.73 ± 0.05