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EMIF06-VID01F2 Datasheet(PDF) 5 Page - STMicroelectronics |
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EMIF06-VID01F2 Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 7 page EMIF06-VID01F2 Package information 5/7 Figure 12. Flip Chip tape and reel specification Note: More packing information is available in the application note AN1235: “Flip Chip: Package description and recommendations for use” AN1751: “EMI Filters: Recommendations and measurements” Figure 10. Footprint recommendations Figure 11. Marking Copper pad diameter: 250 µm recommended, 300 µm max Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 300 µm copper pad diameter Dot, ST logo xx = marking yww = date code (y = year ww = week) z = manufacturing location x y z w x w E Dot identifying Pin A1 location User direction of unreeling All dimensions in mm 4 ± 0.1 1.52 4 ± 0.1 Ø 1.5 ± 0.1 0.73 ± 0.05 |
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