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EMIF03-SIM02F2 Datasheet(PDF) 5 Page - STMicroelectronics |
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EMIF03-SIM02F2 Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 8 page EMIF03-SIM02F2 Ordering information scheme 5/8 3 Ordering information scheme Figure 12. Ordering information scheme 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 13. Package dimensions EMIF yy - xxx zz Fx EMI Filter Number of lines Information Package x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version F = Flip Chip x = 2: lead-free pitch = 500 µm, bump = 315 µm 1.39 mm ± 30 µm 315 µm ± 50 500 µm ± 50 650 µm ± 65 195 µm |
Similar Part No. - EMIF03-SIM02F2_08 |
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Similar Description - EMIF03-SIM02F2_08 |
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