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EMIF03-SIM02F2 Datasheet(PDF) 6 Page - STMicroelectronics |
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EMIF03-SIM02F2 Datasheet(HTML) 6 Page - STMicroelectronics |
6 / 8 page Ordering information EMIF03-SIM02F2 6/8 Figure 16. Flip Chip tape and reel specification Note: More information isavailable in the application notes: AN1235:"Flip Chip: Package description and recommendations for use" AN1751: “EMI filters: Recommendations and measurements” 5 Ordering information Table 3. Ordering information Figure 14. Footprint Figure 15. Marking Copper pad Diameter: 250 µm recommended, 300 µm max Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 315 µm copper pad diameter x y x w z w E Dot, ST logo xx = marking yww = datecode (y = year ww = week) z = manufacturing location Dot identifying Pin A1 location User direction of unreeling All dimensions in mm 4 ± 0.1 4 ± 0.1 Ø 1.5 ± 0.1 0.73 ± 0.05 1.52 Order code Marking Package Weight Base qty Delivery mode EMIF03-SIM02F2 GJ Flip Chip 2.65 mg 5000 Tape and reel 7” |
Similar Part No. - EMIF03-SIM02F2_08 |
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Similar Description - EMIF03-SIM02F2_08 |
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