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ESDA18-1X Datasheet(PDF) 6 Page - STMicroelectronics |
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ESDA18-1X Datasheet(HTML) 6 Page - STMicroelectronics |
6 / 8 page Packing information ESDA18-1F2 6/8 Figure 14. Flip Chip tape and reel specification Note: More packing information is available in the application notes: AN1235: “Flip Chip: Package description and recommendations for use” AN1751: "EMI Filters: Recommendations and measurements" Figure 12. Footprint recommendations Figure 13. Marking Copper pad Diameter: 250 µm recommended, 300µm max Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 315 µm copper pad diameter x y x w z w E Dot, ST logo xx = marking yww = datecode (y = year ww = week) z = manufacturing location Dot identifying Pin A1 location User direction of unreeling All dimensions in mm 4 ± 0.1 1.0 4 ± 0.1 Ø 1.5 ± 0.1 0.73 ± 0.05 |
Similar Part No. - ESDA18-1X |
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Similar Description - ESDA18-1X |
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