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BTB12600SWRG Datasheet(PDF) 8 Page - STMicroelectronics |
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BTB12600SWRG Datasheet(HTML) 8 Page - STMicroelectronics |
8 / 12 page Packaging information BTA12, BTB12, T12xx 8/12 3 Packaging information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 15. Footprint (dimensions in mm) Table 8. D2PAK dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.25 1.40 0.048 0.055 C 0.45 0.60 0.017 0.024 C2 1.21 1.36 0.047 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.28 0.393 0.405 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 R 0.40 0.016 V2 0° 8° 0° 8° G L L3 L2 B B2 E 2mm min. FLAT ZONE A C2 D R A2 V2 C A1 16.90 10.30 8.90 3.70 5.08 1.30 |
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