TPS62601YFFR datasheet(2/21 Pages) TI

Part #	TPS62601YFFR

Description	500-mA, 6-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING

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Manufacturer	TI [Texas Instruments]

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ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS

(1)

TPS62600

TPS62601

SLVS678 – JUNE 2008 ...................................................................................................................................................................................................... www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION(1)

PACKAGE

PART

OUTPUT

TA

PACKAGE

ORDERING(2)(3)

MARKING

NUMBER

VOLTAGE

CHIP CODE

TPS62600

1.83V

TPS62600YFF

G9

-40°C to 85°C

YFF-6

TPS62601

1.8V

TPS62601YFF

GA

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

The YFF package is available in tape and reel. Add a R suffix (TPS62600YFFR) to order quantities of 3000 parts. Add a T suffix

(TPS62600YFFT) to order quantities of 250 parts.

(3)

Internal tap points are available to facilitate output voltages in 25mV increments.

over operating free-air temperature range (unless otherwise noted)

(1)

UNIT

Voltage at VIN, SW(2)

-0.3 V to 7 V

VI

Voltage at FB(2)

-0.3 V to 3.6 V

Voltage at EN, MODE (2)

-0.3 V to VI + 0.3 V

Power dissipation

Internally limited

TA

Operating temperature range(3)

-40°C to 85°C

TJ (max)

Maximum operating junction temperature

150°C

Tstg

Storage temperature range

-65°C to 150°C

Human body model

2 kV

ESD rating (4)

Charge device model

1 kV

Machine model

200 V

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the

maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package

in the application (

θ

JA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)).

(4)

The human body model is a 100-pF capacitor discharged through a 1.5-k

Ω resistor into each pin. The machine model is a 200-pF

capacitor discharged directly into each pin.

POWER RATING

DERATING FACTOR

PACKAGE

RθJA

(2)

RθJB

(2)

TA ≤ 25°C

ABOVE TA = 25°C

YFF-6

125°C/W

53°C/W

800mW

8mW/°C

(1)

Maximum power dissipation is a function of TJ(max), θJA and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = [TJ(max)-TA] / θJA.

(2)

This thermal data is measured with high-K board (4 layers board according to JESD51-7 JEDEC standard).

2

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