Page 3
Page 2
Baud Rate
Initial Start-up
After Valid Rx
With RX_PDN
(Worst Case)
2,400
72.62
38.62
600+72.62
9,600
22.42
12.42
300+22.42
19,200
13.80
7.30
150+13.80
28,800
11.00
6.00
150+11.00
Table 2: Encoder SEND to Decoder Activation Times (mS)
TIMINGS
ELECTRICAL SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
Supply Voltage VCC
-0.3
to
+6.5
VDC
Any Input or Output Pin
-0.3
to VCC + 0.3
VDC
Max. Current Sourced By Output Pins
25
mA
Max. Current Sunk By Output Pins
25
mA
Max. Current Into VCC
250
mA
Max. Current Out Of GND
300
mA
Operating Temperature
-40
to
+125
°C
Storage Temperature
-65
to
+150
°C
*NOTE* Exceeding any of the limits of this section may lead to permanent
damage to the device. Furthermore, extended operation at these maximum
ratings may reduce the life of this device.
1. Current consumption with no active loads.
2. For 3V supply, (0.15 x 3.0) = 0.45V max.
3. For 3V supply, (0.8 x 3.0) = 2.4V min.
Notes
Parameter
Designation
Min.
Typical
Max.
Units
Notes
POWER SUPPLY
Operating Voltage
VCC
2.0
–
5.5
VDC
–
Supply Current:
ICC
At 2.0V VCC
–
240
300
µA
1
At 3.0V VCC
–
370
470
µA
1
At 5.0V VCC
–
670
780
µA
1
Power-Down Current:
IPDN
At 2.0V VCC
–
0.10
0.80
µA
–
At 3.0V VCC
–
0.10
0.85
µA
–
At 5.0V VCC
–
0.20
0.95
µA
–
ENCODER SECTION
Input Low
VIL
0.0
–
0.15 x VCC
V2
Input High
VIH
0.8 x VCC
–VCC
V3
Output Low
VOL
–
–
0.6
V
–
Output High
VOH
VCC - 0.7
–
–
V
–
Input Sink Current
–
–
–
25
mA
–
Output Drive Current
–
–
–
25
mA
–
SEND High to DATA_OUT
–
–
1.64
–
mS
–
ENVIRONMENTAL
Operating Temperature Range
–
-40
–
+125
°C
–
Table 1: Electrical Specifications
*CAUTION*
This product is a static-sensitive component. Always wear an ESD
wrist strap and observe proper ESD handling procedures when
working with this device. Failure to observe this precaution may
result in device damage or failure.
Figure 3: MS Series Reflow Profile
Figure 2: PCB Layout Dimensions
0.047
(1.19)
0.016
(0.41)
0.026
(0.65)
0.328 (8.33)
0.234 (5.94)
RECOMMENDED PAD LAYOUT
The MS Series encoders and decoders are implemented in an industry standard
20-pin Shrink Small Outline Package (20-SSOP). The recommended layout
dimensions are shown below.
240°C Max
0
25
50
75
100
125
150
175
200
225
250
275
020
40
60
80
100
120
140
160
180
200
220
240
260
280
300
320
TIME (SECONDS)
340
360
380
420
400
260°C Max
Lead-Free
Sn / Pb
PRODUCTION CONSIDERATIONS
These surface-mount components are designed to comply with standard reflow
production methods. The recommended reflow profile is shown below and
should not be exceeded, as permanent damage to the part may result.
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