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EVAL-ADUM131X Datasheet(PDF) 3 Page - Analog Devices |
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EVAL-ADUM131X Datasheet(HTML) 3 Page - Analog Devices |
3 / 8 page EVAL-ADuM5401-ADuM5404 Rev. 0 | Page 3 of 8 EVALUATION BOARD HARDWARE PAD LAYOUT FOR THE DUT The evaluation board has a pad layout in U2 that accommo- dates SOP16 wide body devices as shown in Figure 2. Power and ground connections connect to capacitor pads for Side 1 and Side 2. C3 C4 C1 C2 U2 C7 C6 U1 C9 C8 Figure 2. DUT Pad Layout Component U2 Three low inductance, surface-mount bypass capacitors are provided for each side. A 100 nF capacitor is installed on each side in Capacitor C2 and Capacitor C3. In addition, there are 10 μF ceramic X7R capacitors, C1 on Side 1 and C4 on Side 2, that provide high frequency bypassing and ripple reduction. For further ripple reduction in isoPower™ devices like the ADuM540x, tantalum capacitors are added to C10 as a 68 μF value on Side 1 and to C5 as a 22 μF value on Side 2. These large value ceramic and tantalum bypass capacitors are not necessary for non-isoPower devices. Many of the iCoupler devices have configuration pins that allow outputs to be disabled or default levels to be set. These pins are usually located at Pin 7 and Pin 10 in the wide body package. Pull-up 0 Ω resistors on SM Pad R4 and and SM Pad R17 have been provided to pull these pins high. If desired, these pull-up resistors can be removed and pull-down resistors can be installed on R5 and R18. In addition to the U2 DUT space, an additional pad layout is provided at U1, specifically to accommodate another isoPower device, as shown in Figure 3. This is a power supply only device that can be used to provide secondary power for any iCoupler, in standalone mode or as a slave, to boost power to the ADuM540x or ADuM520x devices. The surface-mount resistor pads to control these functions are not populated. Pad layout for the ADuM5000 is provided in U1, but this part is not populated. As can be seen in Figure 3, the power and ground connections for this device are different from the rest of the iCoupler components. Bypass capacitor Pad C6 through Pad C9 are provided but not populated (0.1 μF X7R ceramic capacitors are recommended). Pull-up, pull-down, and connecting resistor pads are provided (but not populated) to connect the ADuM5000 in master or slave mode, as well as to set the output voltage. Figure 3. ADuM5000 Pad Layout Component U1 Grounding Scheme The board consists of two separate ground and power systems. Each side of the DUT can be operated from an independent power and ground reference. This allows simulation of conditions similar to the target application. The board provides for board creepage and clearance typical of most 2.5 kV circuit boards. It is not recommended for use above 2.5 kV rms transient voltages. EMI and EMC Measurements The signal path has been made as simple as possible while still providing flexibility. The board is not intended for detailed characterization of system noise, EMI, or EMC. It may be useful for initial bench work in these areas, but Analog Devices, Inc., does not guarantee that board results will be indicative of the final system performance in these areas. TERMINALS Side 1 Power Supply Inputs Power is supplied to the board via a set of terminal block connectors labeled IO_1C, as shown in Figure 4. Power is connected to the top terminal Pin 1, and ground is connected to the top terminal Pin 2. Provisions for adding in line inductors for noise isolation have been made with the inclusion of Z1 and Z2, which are 1206 size surface-mount components. These positions are populated with 0 Ω resistors to connect power to the board. If isolation inductors are required, these components should be removed and replaced at your discretion. |
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