EVAL-ADuM5401-ADuM5404

Rev. 0 | Page 3 of 8

EVALUATION BOARD HARDWARE

PAD LAYOUT FOR THE DUT

The evaluation board has a pad layout in U2 that accommo-

dates SOP16 wide body devices as shown in Figure 2. Power

and ground connections connect to capacitor pads for Side 1

and Side 2.

C3

C4

C1

C2

U2

C7

C6

U1

C9

C8

Figure 2. DUT Pad Layout Component U2

Three low inductance, surface-mount bypass capacitors are

provided for each side. A 100 nF capacitor is installed on each

side in Capacitor C2 and Capacitor C3.

In addition, there are 10 μF ceramic X7R capacitors, C1 on Side 1

and C4 on Side 2, that provide high frequency bypassing and

ripple reduction. For further ripple reduction in isoPower™

devices like the ADuM540x, tantalum capacitors are added to

C10 as a 68 μF value on Side 1 and to C5 as a 22 μF value on

Side 2. These large value ceramic and tantalum bypass

capacitors are not necessary for non-isoPower devices.

Many of the iCoupler devices have configuration pins that allow

outputs to be disabled or default levels to be set. These pins are

usually located at Pin 7 and Pin 10 in the wide body package.

Pull-up 0 Ω resistors on SM Pad R4 and and SM Pad R17 have

been provided to pull these pins high. If desired, these pull-up

resistors can be removed and pull-down resistors can be

installed on R5 and R18.

In addition to the U2 DUT space, an additional pad layout is

provided at U1, specifically to accommodate another isoPower

device, as shown in Figure 3. This is a power supply only device

that can be used to provide secondary power for any iCoupler,

in standalone mode or as a slave, to boost power to the

ADuM540x or ADuM520x devices. The surface-mount resistor

pads to control these functions are not populated.

Pad layout for the ADuM5000 is provided in U1, but this part is

not populated. As can be seen in Figure 3, the power and ground

connections for this device are different from the rest of the

iCoupler components. Bypass capacitor Pad C6 through Pad C9

are provided but not populated (0.1 μF X7R ceramic capacitors

are recommended). Pull-up, pull-down, and connecting resistor

pads are provided (but not populated) to connect the ADuM5000

in master or slave mode, as well as to set the output voltage.

Figure 3. ADuM5000 Pad Layout Component U1

Grounding Scheme

The board consists of two separate ground and power systems.

Each side of the DUT can be operated from an independent

power and ground reference. This allows simulation of

conditions similar to the target application. The board provides

for board creepage and clearance typical of most 2.5 kV circuit

boards. It is not recommended for use above 2.5 kV rms transient

voltages.

EMI and EMC Measurements

The signal path has been made as simple as possible while still

providing flexibility. The board is not intended for detailed

characterization of system noise, EMI, or EMC. It may be useful

for initial bench work in these areas, but Analog Devices, Inc.,

does not guarantee that board results will be indicative of the

final system performance in these areas.

TERMINALS

Side 1 Power Supply Inputs

Power is supplied to the board via a set of terminal block

connectors labeled IO_1C, as shown in Figure 4. Power is

connected to the top terminal Pin 1, and ground is connected to

the top terminal Pin 2. Provisions for adding in line inductors

for noise isolation have been made with the inclusion of Z1 and

Z2, which are 1206 size surface-mount components. These

positions are populated with 0 Ω resistors to connect power to

the board. If isolation inductors are required, these components

should be removed and replaced at your discretion.