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AD7656BSTZ-1-RL Datasheet(PDF) 10 Page - Analog Devices

Part # AD7656BSTZ-1-RL
Description  250 kSPS, 6-Channel, Simultaneous Sampling, Bipolar, 16-/14-/12-Bit ADC
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD7656BSTZ-1-RL Datasheet(HTML) 10 Page - Analog Devices

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AD7656-1/AD7657-1/AD7658-1
Rev. 0 | Page 10 of 32
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameter
Rating
VDD to AGND, DGND
−0.3 V to +16.5 V
VSS to AGND, DGND
+0.3 V to −16.5 V
VDD to AVCC
VCC − 0.3 V to 16.5 V
AVCC to AGND, DGND
−0.3 V to +7 V
DVCC to AVCC
−0.3 V to AVCC + 0.3 V
DVCC to DGND, AGND
−0.3 V to +7 V
AGND to DGND
−0.3 V to +0.3 V
VDRIVE to DGND
−0.3 V to DVCC + 0.3 V
Analog Input Voltage to AGND1
VSS − 0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND
−0.3 V to VDRIVE + 0.3 V
Digital Output Voltage to DGND
−0.3 V to VDRIVE + 0.3 V
REFIN/REFOUT to AGND
−0.3 V to AVCC + 0.3 V
Input Current to Any Pin Except
Supplies2
±10 mA
Operating Temperature Range
B Version
−40°C to +85°C
Y Version
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature
150°C
Pb/Sn Temperature, Soldering
Reflow (10 sec to 30 sec)
240(+0)°C
Pb-Free Temperature, Soldering Reflow
260(+0)°C
ESD
700 V
1 If the analog inputs are driven from alternative VDD and VSS supply circuitry,
a 240 Ω series resistor should be placed on the analog inputs and Schottky
diodes should be placed in series with the AD7656-1/AD7657-1/AD7658-1’s
VDD and VSS supplies.
2 Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. These
specifications apply to a 4-layer board.
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
64-Lead LQFP
45
11
°C/W
ESD CAUTION


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