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TLK2211RCPG4 Datasheet(PDF) 2 Page - Texas Instruments |
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TLK2211RCPG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 21 page DESCRIPTION (CONTINUED) Differences Between TLK2211, and TNETE2201 TLK2211 SLLS873B – MAY 2008 – REVISED JULY 2008 ................................................................................................................................................................ www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. The primary application of this device is to provide building blocks for point-to-point baseband data transmission over controlled impedance media of 50 Ω or 75 Ω. The transmission media can be printed-circuit board traces, copper cables or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment. The TLK2211 performs the data serialization, deserialization, and clock extraction functions for a physical layer interface device. The transceiver operates at 1.25 Gbps (typical), providing up to 1 Gbps of data bandwidth over a copper or optical media interface. The TLK2211 supports a standard 10-bit interface (TBI) . In the TBI mode the serializer/deserializer (SERDES) accepts 10-bit wide 8b/10b parallel encoded data bytes. The parallel data bytes are serialized and transmitted differentially at PECL compatible voltage levels. The SERDES extracts clock information from the input serial stream and deserializes the data, outputting a parallel 10-bit data byte. The TLK2211 provides a comprehensive series of built-in tests for self-test purposes including loopback and pseudo random binary sequence (PRBS) generation and verification. An IEEE 1149.1 JTAG port is also supported. The TLK2211 is housed in a high performance, thermally enhanced, 64-pin VQFP PowerPAD package. Use of the PowerPAD package does not require any special considerations except to note that the PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. It is recommended that the TLK2211 PowerPADs be soldered to the thermal land on the board. The TLK2211 is characterized for operation from –40°C to 85°C. The TLK2211 use a 3.3-V supply. The I/O section is 3.3-V compatible. With the 3.3-V supply the chipset is very power-efficient, dissipating less than 600 mW typical power when operating at 1.25 Gbps. The TLK2211 is designed to be hot plug capable. A power-on reset causes RBC0, RBC1, the parallel output signal terminals, TXP, and TXN to be held in high-impedance state. The TLK2211 is a functional equivalent of the TNETE2201. There are several differences between the devices as noted below. Refer to Figure 10 in the application information section for an example of a typical application circuit. • The PLL filter capacitors on pins 16, 17, 48, and 49 of the TNETE2201 are no longer required. The TLK2211 uses these pins to provide added test capabilities. The capacitors, if present, do not affect the operation of the device. • No pulldown resistors are required on the TXP/TXN outputs. AVAILABLE OPTIONS PACKAGE(1) TA PLASTIC QUAD FLAT PACK (RCP) TLK2211RCP –40°C to 85°C TLK2211RCPR (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s) :TLK2211 |
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