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Nichia

STSE-CG7146A

<Cat.No.070713>

(4) Soldering Conditions

· Nichia LED leadframes are silver plated copper alloy.

This substance has a low

thermal coefficient (easily conducts heat).

Careful attention should be paid during soldering.

· Solder the LED no closer than 3mm from the base of the epoxy bulb.

Soldering beyond the base

of the tie bar is recommended.

· Recommended soldering conditions

Dip Soldering

Hand Soldering

Pre-Heat

Pre-Heat Time

Solder Bath

Temperature

Dipping Time

Dipping Position

120°C Max.

60 seconds Max.

260°C Max.

10 seconds Max.

No lower than 3 mm from the

base of the epoxy bulb.

Temperature

Soldering Time

Position

350°C Max.

3 seconds Max.

No closer than 3 mm from the

base of the epoxy bulb.

· Although the recommended soldering conditions are specified in the above table, dip or hand

soldering at the lowest possible temperature is desirable for the LEDs.

· A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.

· Dip soldering should not be done more than one time.

· Hand soldering should not be done more than one time.

· Do not apply any stress to the lead particularly when heated.

· The LEDs must not be repositioned after soldering.

· After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until

the LEDs return to room temperature.

· Direct soldering onto a PC board should be avoided.

Mechanical stress to the resin may be caused

from warping of the PC board or from the clinching and cutting of the leadframes.

When it is

absolutely necessary, the LEDs may be mounted in this fashion but the User will assume responsibility

for any problems.

Direct soldering should only be done after testing has confirmed that no damage,

such as wire bond failure or resin deterioration, will occur.

Nichia’s LEDs should not be soldered

directly to double sided PC boards because the heat will deteriorate the epoxy resin.

· When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize

the mechanical stress on the LEDs.

· Cut the LED leadframes at room temperature.

Cutting the leadframes at high temperatures may

cause failure of the LEDs.

(5) Heat Generation

· Thermal design of the end product is of paramount importance.

Please consider the heat generation

of the LED when making the system design.

The coefficient of temperature increase per input

electric power is affected by the thermal resistance of the circuit board and density of LED

placement on the board, as well as other components. It is necessary to avoid intense heat generation

and operate within the maximum ratings given in this specification.

· The operating current should be decided after considering the ambient maximum temperature of LEDs.

(6) Cleaning

· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.

When using

other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not.

Freon solvents should not be used to clean the LEDs because of worldwide regulations.

· Do not clean the LEDs by the ultrasonic.

When it is absolutely necessary, the influence of ultrasonic

cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.

Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.