-9-

(6) Soldering Conditions

· The LEDs can be soldered in place using the reflow soldering method.

Nichia cannot make a

guarantee on the LEDs after they have been assembled using the dip or hand soldering method.

· Recommended soldering conditions

Reflow Soldering

Lead Solder

Lead-free Solder

Pre-heat

Pre-heat time

Peak

temperature

Soldering time

Condition

120

120 sec. Max.

240°C Max.

10 sec. Max.

refer to

Temperature - profile

180

120 sec. Max.

260°C Max.

10 sec. Max.

refer to

Temperature - profile

Although the recommended soldering conditions are specified in the above table, reflow

soldering at the lowest possible temperature is desirable for the LEDs.

A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.

[Temperature-profile (Surface of circuit board)]

Use the conditions shown to the under figure.

[Recommended soldering pad design]

Use the following conditions shown in the figure.

· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere

during air reflow.

It is recommended that the User use the nitrogen reflow method.

· Repairing should not be done after the LEDs have been soldered.

When repairing is unavoidable,

a hot plate should be used.

It should be confirmed beforehand whether the characteristics of the LEDs

will or will not be damaged by repairing.

· Reflow soldering should not be done more than two times.

· Die Heat sink is to be soldered.

· When soldering, do not put stress on the LEDs during heating.

· After soldering, do not warp the circuit board.

(Unit : mm)

4.0

2.8

1.8

4-R0.3

120sec.Max.

Pre-heating

260°C Max.

10sec. Max.

60sec.Max.

Above 220°C

1 ~ 5°C / sec.

1 ~ 5°C / sec.

180 ~ 200°C

Pre-heating

240°C Max.

10sec. Max.

60sec.Max.

Above 200

°C

2.5 ~ 5°C / sec.

2.5 ~ 5°C / sec.

120 ~ 150°C

120sec.Max.

Nichia STS-DA1-0202

<Cat.No.080513>