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NSSR064T Datasheet(PDF) 7 Page - NICHIA CORPORATION |
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NSSR064T Datasheet(HTML) 7 Page - NICHIA CORPORATION |
7 / 14 page -6- (5) Soldering Conditions · The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. · Recommended soldering conditions Reflow Soldering Hand Soldering Lead Solder Lead-free Solder Pre-heat Pre-heat time Peak temperature Soldering time Condition 120 ~ 150°C 120 sec. Max. 240°C Max. 10 sec. Max. refer to Temperature - profile 1. 180 ~ 200°C 120 sec. Max. 260°C Max. 10 sec. Max. refer to Temperature - profile 2. (N2 reflow is recommended.) Temperature Soldering time 350°C Max. 3 sec. Max. (one time only) Although the recommended soldering conditions are specified in the above table, reflow or hand soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. [Recommended soldering pad design] Use the following conditions shown in the figure. · Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. · The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resin should be used. · Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. · Reflow soldering should not be done more than two times. · When soldering, do not put stress on the LEDs during heating. · After soldering, do not warp the circuit board. (Unit : mm) : Solder resist 4 4 9.5 1.5 1.5 < 1 : Lead Solder> < 2 : Lead-free Solder> 120sec.Max. Pre-heating 260°C Max. 10sec. Max. 60sec.Max. Above 220°C 1 ~ 5°C / sec. 1 ~ 5°C / sec. 180 ~ 200°C Pre-heating 240°C Max. 10sec. Max. 60sec.Max. Above 200 °C 2.5 ~ 5°C / sec. 2.5 ~ 5°C / sec. 120 ~ 150°C 120sec.Max. Nichia STS-DA1-0293 <Cat.No.080620> |
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