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EM7164SU16W-90LF Datasheet(PDF) 3 Page - Emerging Memory & Logic Solutions Inc |
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EM7164SU16W-90LF Datasheet(HTML) 3 Page - Emerging Memory & Logic Solutions Inc |
3 / 12 page EM7164SU16W Series 1Mx16 Single Transistor RAM 3 Preliminary GENERAL WAFER SPECIFICATIONS - Process Technology : 0.13um CMOS Deep trench process - 3 Metal layers including local inter-connection - Wafer thickness : 725 +/- 25um - Minimum Pad Pitch : 100um - Wafer diameter : 8-inch +(0.0) 1M x16 bit Single Transistor RAM x y DEVICE CODE (EM716XSU16) PAD DESCRIPTION Name Function Name Function /CS Chip select inputs /LB Lower byte (DQ0~7) /OE Output enable input /UB Upper byte (DQ8~15) /WE Write enable input VCC Power supply /ZZ Low Power Control VCCQ I/O Power supply DQ0-15 Data In-out VSS(Q) Ground A0-19 Address inputs NC No connection |
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