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SN74LVC2G79DCUR Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC2G79DCUR Datasheet(HTML) 1 Page - Texas Instruments |
1 / 14 page www.ti.com FEATURES Seemechanicaldrawingsfordimensions. DCTPACKAGE (TOP VIEW) DCUPACKAGE (TOP VIEW) YZP PACKAGE (BOTTOMVIEW) 1 V CC 8 1CLK 2 7 1D 1Q 3 6 2Q 2D 4 5 GND 2CLK 3 6 2D 2Q 8 1 V CC 1CLK 5 GND 4 2CLK 2 7 1Q 1D GND 5 4 2CLK 3 6 2D 2Q 2 7 1Q 1D 8 V CC 1 1CLK DESCRIPTION/ORDERING INFORMATION SN74LVC2G79 DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP SCES498D – OCTOBER 2003 – REVISED FEBRUARY 2007 • Available in the Texas Instruments • Typical V OHV (Output VOH Undershoot) NanoFree™ Package >2 V at VCC = 3.3 V, TA = 25°C • Supports 5-V V CC Operation • I off Feature Supports Partial-Power-Down Mode Operation • Inputs Accept Voltages to 5.5 V • Latch-Up Performance Exceeds 100 mA Per • Max t pd of 4.2 ns at 3.3 V JESD 78, Class II • Low Power Consumption, 10-µA Max I CC • ESD Protection Exceeds JESD 22 • ±24-mA Output Drive at 3.3 V – 2000-V Human-Body Model (A114-A) • Typical V OLP (Output Ground Bounce) – 200-V Machine Model (A115-A) <0.8 V at V CC = 3.3 V, TA = 25°C – 1000-V Charged-Device Model (C101) This dual positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation. When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP Reel of 3000 SN74LVC2G79YZPR _ _ _CR_ (Pb-free) –40 °C to 85°C SSOP – DCT Reel of 3000 SN74LVC2G79DCTR C79_ _ _ VSSOP – DCU Reel of 3000 SN74LVC2G79DCUR C79_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2003–2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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