Surface Mount Moisture Sensitivity Specifications

1. Controlling Moisture

Unity Opto Technology, in its design of packing materials and packing methods, takes into consideration the susceptibility of

some Unity packages to moisture induced damage. The risk of this damage is caused when the LED lens plastic encapsulation

material is exposed to increases or decreases in the Relative Humidity of the surrounding environment.

Such damage may include delamination between the die and the LED lens plastic encapsulation material, which may result in

open connections due to broken wire bonds. Moisture in the package having reached a critical level will fracture the package

in order to escape when exposed to peak temperature conditions, typical in soldering practices.

Therefore, the control of moisture levels in the LED package is critical to reduce the risk of moisture-induced failures. Please

follow JEDEC-STD-033A standards for handling moisture sensitive devices.

2. Packaging SMD devices:

Unity packages all SMD devices into dry pack bags (moisture barrier bags).

Unity includes a desiccant pouch in each bag. Testing confirms that the desiccant pouch greatly reduces the presence of

moisture by maintaining the environment in the bag, thus protecting the devices during shipment and storage.

3. Handling Dry Packed Parts

Upon receipt, the bags should be inspected for damage to ensure that the bag’s integrity has been maintained. Inspection

should verify that there are no holes, gouges, tears, or punctures of any kind that may expose the contents of the bag.

To open the bag, simply cut across the top of the bag as close to the original seal as possible being careful not to damage the

contents. Once open the desired quantity of units should be removed and the bag resealed. If the bag is left open longer than

2 hours, the desiccant pouch should be replaced with a dry desiccant and the bag should be sealed immediately to avoid

moisture damage.

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