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HMC-MDB172 Datasheet(PDF) 3 Page - Hittite Microwave Corporation |
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HMC-MDB172 Datasheet(HTML) 3 Page - Hittite Microwave Corporation |
3 / 8 page 3 3 - 172 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC-MDB172 v00.0907 GaAs MMIC I/Q MIXER 19 - 33 GHz Outline Drawing NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. TYPICAL BOND PAD IS .004” SQUARE. 3. BACKSIDE METALLIZATION: GOLD. 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 7. OVERALL DIE SIZE ±.002” Die Packaging Information [1] Standard Alternate WP-19 [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. |
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