08055A102FAT2A datasheet(42/46 Pages) AVX

Part #	08055A102FAT2A

Description	Multilayer Ceramic Chip Capacitor

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Manufacturer	AVX [AVX Corporation]

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41

Surface Mounting Guide

MLC Chip Capacitors

Component Pad Design

Component pads should be designed to achieve good sol-

der filets and minimize component movement during reflow

soldering. Pad designs are given below for the most com-

mon sizes of multilayer ceramic capacitors for both wave

and reflow soldering. The basis of these designs is:

• Pad width equal to component width. It is permissible to

decrease this to as low as 85% of component width but it

is not advisable to go below this.

• Pad overlap 0.5mm beneath component.

• Pad extension 0.5mm beyond components for reflow and

1.0mm for wave soldering.

D1

D2

D3

D4

D5

Case Size

D1

D2

D3

D4

D5

0402

1.70 (0.07)

0.60 (0.02)

0.50 (0.02)

0.60 (0.02)

0.50 (0.02)

0603

2.30 (0.09)

0.80 (0.03)

0.70 (0.03)

0.80 (0.03)

0.75 (0.03)

0805

3.00 (0.12)

1.00 (0.04)

1.25 (0.05)

1206

4.00 (0.16)

1.00 (0.04)

2.00 (0.09)

1.00 (0.04)

1.60 (0.06)

1210

4.00 (0.16)

1.00 (0.04)

2.00 (0.09)

1.00 (0.04)

2.50 (0.10)

1808

5.60 (0.22)

1.00 (0.04)

3.60 (0.14)

1.00 (0.04)

2.00 (0.08)

1812

5.60 (0.22)

1.00 (0.04))

3.60 (0.14)

1.00 (0.04)

3.00 (0.12)

1825

5.60 (0.22)

1.00 (0.04)

3.60 (0.14)

1.00 (0.04)

6.35 (0.25)

2220

6.60 (0.26)

1.00 (0.04)

4.60 (0.18)

1.00 (0.04)

5.00 (0.20)

2225

6.60 (0.26)

1.00 (0.04)

4.60 (0.18)

1.00 (0.04)

6.35 (0.25)

Dimensions in millimeters (inches)

REFLOW SOLDERING

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