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08051A100DAT2A Datasheet(PDF) 43 Page - AVX Corporation |
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08051A100DAT2A Datasheet(HTML) 43 Page - AVX Corporation |
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43 / 46 page  42 WAVE SOLDERING Component Spacing For wave soldering components, must be spaced sufficiently far apart to avoid bridging or shadowing (inability of solder to penetrate properly into small spaces). This is less impor- tant for reflow soldering but sufficient space must be allowed to enable rework should it be required. Preheat & Soldering The rate of preheat should not exceed 4°C/second to prevent thermal shock. A better maximum figure is about 2°C/second. For capacitors size 1206 and below, with a maximum thickness of 1.25mm, it is generally permissible to allow a temperature differential from preheat to soldering of 150°C. In all other cases this differential should not exceed 100°C. For further specific application or process advice, please consult AVX. Cleaning Care should be taken to ensure that the capacitors are thoroughly cleaned of flux residues especially the space beneath the capacitor. Such residues may otherwise become conductive and effectively offer a low resistance bypass to the capacitor. Ultrasonic cleaning is permissible, the recommended conditions being 8 Watts/litre at 20-45 kHz, with a process cycle of 2 minutes vapor rinse, 2 minutes immersion in the ultrasonic solvent bath and finally 2 minutes vapor rinse. Surface Mounting Guide MLC Chip Capacitors D1 D2 D3 D4 D5 Case Size D1 D2 D3 D4 D5 0603 3.10 (0.12) 1.20 (0.05) 0.70 (0.03) 1.20 (0.05) 0.75 (0.03) 0805 4.00 (0.15) 1.50 (0.06) 1.00 (0.04) 1.50 (0.06) 1.25 (0.05) 1206 5.00 (0.19) 1.50 (0.06) 2.00 (0.09) 1.50 (0.06) 1.60 (0.06) 1210 5.00 (0.19) 1.50 (0.06) 2.00 (0.09) 1.50 (0.06) 2.50 (0.10) Dimensions in millimeters (inches) ≥1mm (0.04) ≥1.5mm (0.06) ≥1mm (0.04) |
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