11

LTC1860/LTC1861

18601f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

MS Package

10-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1661)

PACKAGE DESCRIPTIO

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660)

MSOP (MS8) 1001

0.53

± 0.015

(.021

± .006)

SEATING

PLANE

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.18

(.077)

0.254

(.010)

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

0.13

± 0.05

(.005

± .002)

0.86

(.034)

REF

0.65

(.0256)

BCS

0

° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

12

3

4

4.88

± 0.1

(.192

± .004)

8

7 6 5

3.00

± 0.102

(.118

± .004)

(NOTE 3)

3.00

± 0.102

(.118

± .004)

NOTE 4

0.52

(.206)

REF

5.23

(.206)

MIN

3.2 – 3.45

(.126 – .136)

0.889

± 0.127

(.035

± .005)

RECOMMENDED SOLDER PAD LAYOUT

0.42

± 0.04

(.0165

± .0015)

TYP

0.65

(.0256)

BSC

MSOP (MS) 1001

0.53

± 0.01

(.021

± .006)

SEATING

PLANE

0.18

(.007)

1.10

(.043)

MAX

0.17 – 0.27

(.007 – .011)

0.13

± 0.05

(.005

± .002)

0.86

(.034)

REF

0.50

(.0197)

TYP

12 3 45

4.88

± 0.10

(.192

± .004)

0.497

± 0.076

(.0196

± .003)

REF

8

9

10

7 6

3.00

± 0.102

(.118

± .004)

(NOTE 3)

3.00

± 0.102

(.118

± .004)

NOTE 4

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.254

(.010)

0

° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

5.23

(.206)

MIN

3.2 – 3.45

(.126 – .136)

0.889

± 0.127

(.035

± .005)

RECOMMENDED SOLDER PAD LAYOUT

0.305

± 0.038

(.0120

± .0015)

TYP

0.50

(.0197)

BSC

S8 Package

8-Lead Plastic Small Outline (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1610)

0.016 – 0.050

(0.406 – 1.270)

0.010 – 0.020

(0.254 – 0.508)

× 45°

0

°– 8° TYP

0.008 – 0.010

(0.203 – 0.254)

SO8 1298

0.053 – 0.069

(1.346 – 1.752)

0.014 – 0.019

(0.355 – 0.483)

TYP

0.004 – 0.010

(0.101 – 0.254)

0.050

(1.270)

BSC

1

2

3

4

0.150 – 0.157**

(3.810 – 3.988)

8

7

6

5

0.189 – 0.197*

(4.801 – 5.004)

0.228 – 0.244

(5.791 – 6.197)

DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

*

**