AP1538SDPG-13 datasheet(10/14 Pages) DIODES

10 / 14 page

AP1538

18V 3A 300KHz BUCK CONVERTER

AP1538

Rev.

2

10 of 14

JUNE 2008

www.diodes.com

Top Side Layout Guide

Bottom Side Layout Guide

Functional Description

(Continued)

Use vias to conduct the heat into the backside of

PCB layer. The heat sink at output (SW) pins should

be allowed for maximum solder-painted area.

Keep the gap of exposed pads from short circuit.

Recommended exposed-pads gap: 30~40mil

(0.75~1mm)

Brown: IC exposed pads.

Red: recommended layout.

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