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G6WK-1P-R Datasheet(PDF) 7 Page - Omron Electronics LLC |
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G6WK-1P-R Datasheet(HTML) 7 Page - Omron Electronics LLC |
7 / 8 page 7 G6W G6W Recommended Soldering Method IRS Method (for Surface-mounting Terminal Relays) • Temperatures indicate the surface temperatures of the PCB. • The thickness of cream solder to be applied should be within a range between 150 and 200 µm on OMRON's recommended PCB pattern. Visually check that the Relay is properly soldered. Precautions For general precautions, refer to the PCB Relay Catalog (X033). Familiarize yourself with the precautions and glossary before using the G6W. Correct Use High-frequency Characteristics Measurement Method and Substrate to be Measured High-frequency Characteristics for G6W are measured as shown below. Through-hole substrate 220 to 245 180 to 200 150 Soldering Preheating 90 to 120 20 to 30 Time (s) Relay Solder Insufficient amount of solder Excessive amount of solder Terminal PCB Land Correct Soldering Incorrect Soldering G6W-1 50- termination resistances Vector network analyzer (Manufacture: Agilent Technologies) HP8753D Convex position Undersurface of relay 30 20 1.5 0.5 4.5 1.5 0.5 0.5 0.4 1.8-dia. 8.6 3 Twenty seven, 0.6-dia., through-hole 1.5 1.8 0.5 3 45˚ R2.1 R0.6 45˚ Through-hole |
Similar Part No. - G6WK-1P-R |
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Similar Description - G6WK-1P-R |
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