CM1233-08DE datasheet(3/10 Pages) CALMIRCO

Part #	CM1233-08DE

Description	PicoGuard XSTM eXtreme Speed ESD Clamp Array For High Speed Data Line Protection

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Manufacturer	CALMIRCO [California Micro Devices Corp]

Direct Link	http://www.calmicro.com

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490 N. McCarthy Blvd., Milpitas, CA 95035-5112

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Tel: 408.263.3214

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Fax: 408.263.7846

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www.cmd.com

3

Issue A – 03/18/08

CM1233

The PicoGuard XS Architecture Advantages

Figure 2 illustrates a standard ESD protection device.

The

inductor

element

represents

the

parasitic

inductance arising from the bond wire and the PCB

trace leading to the ESD protection diodes.

Figure 2. Standard ESD Protection Model

Figure 3 illustrates one of the channels. Similarly, the

inductor elements represent the parasitic inductance

arising from the bond wire and PCB traces leading to

the ESD protection diodes as well.

Figure 3. CM1233 PicoGuard XS ESD Protection

Model

CM1233 Inductor Elements

In the CM1233 PicoGuard XS architecture, the

inductor elements and ESD protection diodes interact

differently compared to the standard ESD model.

In the standard ESD protection device model, the

inductive element presents high impedance against

high slew rate strike voltage, i.e. during an ESD strike.

The impedance increases the resistance of the

conduction

path

leading

to

the

ESD

protection

element. This limits the speed that the ESD pulse can

discharge through the ESD protection element.

In the PicoGuard XS architecture, the inductive

elements are in series to the conduction path leading

to the protected device. The elements actually help to

limit the current and voltage striking the protected

device.

First the reactance of the inductive element, L1, on the

connector side when an ESD strike occurs, acts in the

opposite direction of the ESD striking current. This

helps limit the peak striking voltage. Then the

reactance of the inductive element, L2, on the ASIC

side forces this limited ESD strike current to be

shunted through the ESD protection diodes. At the

same time, the voltage drop across both series

element acts to lower the clamping voltage at the

protected device terminal.

Through this arrangement, the inductive elements also

tune the impedance of the ESD protection element by

cancelling the capacitive load presented by the ESD

diodes to the signal line. This improves the signal

integrity and makes the overall ESD protection device

more transparent to the high bandwidth data signals

passing through the channel.

The innovative PicoGuard XS architecture turns the

disadvantages of the parasitic inductive elements into

useful components that help to limit the ESD current

strike to the protected device and also improves the

signal integrity of the system by balancing the

capacitive loading effects of the ESD diodes. At the

same time, this architecture provides an impedance

matched signal path for 50

Ω loading applications.

Board designs can take advantage of precision internal

component matching for improved signal integrity,

which

is

not

otherwise

possible

with

discrete

components at the system level. This helps to simplify

the PCB layout considerations by the system designer

and eliminates the associated passive components for

load matching that is normally required with standard

ESD protection circuits.

Each ESD channel consists of a pair of diodes in

series which steer the positive or negative ESD current

pulse to either the Zener diode or to ground. This

embedded Zener diode also serves to eliminate the

need for a separate bypass capacitor to absorb

positive ESD strikes to ground. The CM1233 protects

against ESD pulses up to ±8kV contact per the IEC

61000-4-2 standard.

ESD

Stage

Bond Wire

Inductance

ASIC

Connector

ESD

Device

50

Ω

L1

L2

Connector

ASIC

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CM1233-08DE Datasheet(PDF) 3 Page - California Micro Devices Corp

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