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EMIF02-USB05F2 Datasheet(PDF) 5 Page - STMicroelectronics |
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EMIF02-USB05F2 Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 7 page  EMIF02-USB05F2 Package information 5/7 3 Package information Figure 8. Flip-Chip package dimensions Figure 11. Flip-Chip tape and reel specification Figure 9. Foot print recomendations Figure 10. Marking 0.92 mm ± 50 µm 315 µm ± 50 500 µm ± 10 650 µm ± 65 Copper pad Diameter: 250 µm recommended, 300 µm max Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 315 µm copper pad diameter x y x w z w E Dot, ST logo xx = marking yww = datecode (y = year ww = week) z = manufacturing location Dot identifying Pin A1 location User direction of unreeling All dimensions in mm 4 +/- 0.1 4 +/- 0.1 Ø 1.5 +/- 0.1 0.73 +/- 0.05 |
Similar Part No. - EMIF02-USB05F2 |
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Similar Description - EMIF02-USB05F2 |
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