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RBO40-40T Datasheet(PDF) 10 Page - STMicroelectronics |
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RBO40-40T Datasheet(HTML) 10 Page - STMicroelectronics |
10 / 15 page SOLDERING RECOMMENDATION The soldering process causes considerable thermal stress to a semiconductor component. This has to be minimized to assure a reliable and extended lifetime of the device. The PowerSO-10 package can be exposed to a maximum temperature of 260 °C for 10 seconds. However a proper soldering of the package could be done at 215 °C for 3 seconds. Any solder temperature profile should be within these limits. As reflow techniques are most common in surface mounting, typical heating profiles are given in Figure 1,either for mounting on FR4 or on metal-backed boards. For each particular board, the appropriate heat profile has to be adjusted experimentally. The present proposal is just a starting point. In any case, the following precautions have to be considered : - always preheat the device - peak temperature should be at least 30 °C higher than the melting point of the solder alloy chosen - thermal capacity of the base substrate Voids pose a difficult reliability problem for large surface mount devices. Such voids under the package result in poor thermal contact and the high thermal resistance leads to component failures. The PowerSO-10 is designed from scratch to be solely a surface mount package, hence symmetry in the x- and y-axis gives the package excellent weight balance. Moreover, the PowerSO-10 offers the unique possibility to control easily the flatness and quality of the soldering process. Both the top and the bottom soldered edges of the package are accessible for visual inspection (soldering meniscus). Coplanarity between the substrate and the package can be easily verified. The quality of the solder joints is very important for two reasons : (I) poor quality solder joints result directly in poor reliability and (II) solder thickness affects the thermal resistance significantly. Thus a tight control of this parameter results in thermally efficient and reliable solder joints. Fig. 1 : Typical reflow soldering heat profile Time (s) Temperature ( C) 0 40 80 120 160 200 240 280 320 360 0 50 100 150 200 250 o 215 C o Soldering Preheating Cooling 245 C o Epoxy FR4 board Metal-backed board ® RBO40-40G / RBO40-40M / RBO40-40T 10/15 |
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