PS7200A-1A

RECOMMENDED SOLDERING CONDITIONS

(1) Infrared reflow soldering

• Peak reflow temperature

235 °C or below (package surface temperature)

•Time of temperature higher than 210 °C

30 seconds or less

• Number of reflows

Two

• Flux

Rosin flux containing small amount of chlorine

(The flux with a maximum chlorine content of 0.2 Wt % is recommended.)

Recommended Temperature Profile of Infrared Reflow

(2) Dip soldering

•Temperature

260 °C or below (molten solder temperature)

•Time

10 seconds or less

• Number of times

One

• Flux

Rosin flux containing small amount of chlorine

(The flux with a maximum chlorine content of 0.2 Wt % is recommended.)

(3) Cautions

• Fluxes

Avoid removing the residual flux with freon-based cleaning solvent.

Time (s)

100 to 160 ˚C

60 to 120 s

(preheating)

(heating)

to 10 s

to 30 s

235 ˚C (peak temperature)

210 ˚C

EXCLUSIVE NORTH AMERICAN AGENT FOR NEC RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS

CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279

Internet: http://WWW.CEL.COM

09/04/2001

DATA SUBJECT TO CHANGE WITHOUT NOTICE