Please follow these handling precautions to prevent damage to the chip and

ensure its reliability.

1. Soldering conditions:

• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)

Soldering time: 3 sec. max.

• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)

60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.

• Reflow Soldering:

2. Cleaning:

• If cleaning is required, use the following solutions for less than 1 minute,

at less than 40°C.

• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.

• Effect of ultrasonic cleaning on the LED resin body differs depending on such

factors as the oscillator output, size of PCB and LED mounting method. The

use of ultrasonic cleaning should be enforced at proper output after confirming

there is no problem.

Product specifications subject to change without notice. PG1101W-0301

BR, AA, AY, PY, PG, BG

Stanley Electric Sales of America, Inc.

• Fax: 949-222-0555

Website: www.stanley-electric.com

Operation Heating

Pre-heating

Temperature

rise: 5°C/sec.

Cooling:

—5°C/sec.

60 to 120 sec.

5 sec. max

0

120

150

240

°C

(0.2)

(1.7)

(1.8)

Center

Hole

φ 1.1)

(

4+0.1

φ 1.5

+0.1

0

2+0.05

4+0.1

Direction to pull

Quantity on tape:

2,500 pieces

per reel

(Ta=25°C)

Power Dissipation

Forward Current

Peak Forward Current

Reverse Voltage

Operating Temperature

Storage Temperature

Derating*

Symbol

Pd

Topr

Tstg

mW

mA

mA

V

°C

°C

mA/°C

* Ta=25°C,

0.42 (DC) 0.93 (Pulse)

Units

Item

-30 to +85

-40 to +100

Red

BR

60

30

70

4

Orange

AA

75

30

70

4

Yellow

AY

75

30

70

4

Green

PG

75

30

70

4

φ 21+0.8

9+0.3

11.4+1

φ 13+0.2

φ 180

+0

3

2+0.5

Yellow

Green

PY

75

30

70

4

Pure

Green

BG

75

30

70

4