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USBDF01W5 Datasheet(PDF) 9 Page - STMicroelectronics |
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USBDF01W5 Datasheet(HTML) 9 Page - STMicroelectronics |
9 / 11 page USBDFxxW5 Package information 9/11 3 Package information Figure 15. Recommended footprint (dimensions in mm) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 3. SOT323-5L dimensions Ref. Dimensions Millimeters Inches Min. Max. Min. Max. A 0.8 1.1 0.031 0.043 A1 0 0.1 0 0.004 A2 0.8 1 0.031 0.039 b 0.15 0.3 0.006 0.012 c 0.1 0.18 0.004 0.007 D 1.8 2.2 0.071 0.086 E 1.15 1.35 0.045 0.053 e 0.65 Typ. 0.025 Typ. H 1.8 2.4 0.071 0.094 Q1 0.1 0.4 0.004 0.016 A1 A2 A L HE c Q1 b E D e e 0.3 1.0 1.0 2.9 0.35 |
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