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E3X-NT11 Datasheet(PDF) 5 Page - Omron Electronics LLC |
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E3X-NT11 Datasheet(HTML) 5 Page - Omron Electronics LLC |
5 / 52 page E3X-N E3X-N 5 Indicates models that allow free cutting. Models without this mark do not allow free cutting. Model Appearance Sensing distance (standard object: opaque) (NT: E3X-NT jj; NM: E3X-NMjj NV: E3X-NV21; NVG: E3X-NVG21 ) Min. sensing object (copper wire) Features White paper Black paper E32-R21 +E39-R3*4 M6 screw Reflector E39-R3 NT: 25 to 250 mm (35-mm dia. min.)*1 NM: 25 to 250 mm (35-mm dia. min.)*1 NV: 25 to 250 mm ( 35-mm dia. min.) --- NT: 0.3-mm dia. NM: 0.6-mm dia. NV: 0.3-mm dia. Transparent objects detection Retroreflective (with M.S.R. function)*5 E32-R16 +E39-R1*4 Reflector E39-R1 NT: 150 to 1,500 mm (35-mm dia. min.)*1 NM: 150 to 1,500 mm (35-mm dia. min.)*1 NV: 150 to 1,500 mm (35-mm dia. min.)*1 --- NT: 0.5-mm dia. NM: 1.9-mm dia. NV: 0.5-mm dia. Transparent objects detection E32-L25*2 NT: 3.3 mm (2.5 x 2.5 cm) NM: 3.3 mm (2.5 x 2.5 cm) NV: 3.3 mm (2.5 x 2.5 cm) --- NT: 0.012-mm dia. NM: 0.015-mm dia. NV: 0.012-mm dia. Limited reflective; detects wafers and small difference in height E32-L25A*2 NT: 3.3 mm (2.5 x 2.5 cm) NM: 3.3 mm (2.5 c 2.5 cm) NV: 3.3 mm (2.5 x 2.5 cm*1) --- NT: 0.012-mm dia. NM: 0.015-mm dia. NV: 0.012-mm dia. Limited reflective; detects wafers and small difference in height E32-L25L*2, 3 NT: 7.2 ±1.8 mm (2.5 x 2.5 cm) NM: 7.2 ±1.8 mm (2.5 x 2.5 cm) NV: 7.2 ±1.8 mm (2.5 x 2.5 cm*1) --- NT: 0.012-mm dia. NM: 0.015-mm dia. NV: 0.012-mm dia. Limited reflective, long distance; detects wafers and small difference in height E32-L24L*3 NT: 4 ±2 mm (2.5 x 2.5 cm) NM: 4 ±2 mm (2.5 x 2.5 cm) NV: 4 ±2 mm (2.5 x 2.5 cm) --- NT: 0.012-mm dia. NM: 0.015-mm dia. NV: 0.012-mm dia. Limited reflective, long distance, side-view; detects wafers and small difference in height *1 Standard object: opaque *2 For standard sensing distances, refer to Dimensions. *3 For continuous operation, use the products within the temperature ranging from –40 _C to 90_C. *4 The operating ambient temperature of the reflectors supplied with the product are the same as that for the E32-R21 and E32-R16. *5 The M.S.R. (mirror surface rejection) function provides stable sensing for glossy objects. Indicates models that allow free cutting. Models without this mark do not allow free cutting. Fine Through-beam Sensors Model Appearance Sensing distance (standard object: opaque) (NT: E3X-NT jj; NM: E3X-NMjj NV: E3X-NV21; NVG: E3X-NVG21 ) Min. sensing object (opaque objects) Features E32-T22S 3-mm dia. NT: 650 mm (1.7-mm dia. min.) NM: 650 mm (1.7-mm dia. min.) NV: 650 mm (1.7-mm dia. min.) NT: 0.2-mm dia. NM: 0.4-mm dia. NV: 0.2-mm dia. General-purpose; detects wafers and small difference in height E32-T24S 3.5 x 3 mm dia. NT: 480 mm (2-mm dia. min.) NM: 450 mm (2-mm dia. min.) NV: 480 mm (2-mm dia. min.) NT: 0.2-mm dia. NM: 0.4-mm dia. NV: 0.2-mm dia. Side-view; detects wafers and small difference in height E32-T84S NT: 480 mm (2-mm dia. min.) NM: 450 mm (2-mm dia. min.) NV: 480 mm (2-mm dia. min.) NT: 0.3-mm dia. NM: 0.3-mm dia. NV: 0.3-mm dia. L-shaped through-beam; heat resistance of up to 200 _C.* * The resistive temperature varies with the part of the Fiber Unit. For details, refer to Dimensions. Slot Sensor Model Appearance Sensing distance (standard object: opaque) (NT: E3X-NT jj; NM: E3X-NMjj NV: E3X-NV21; NVG: E3X-NVG21 ) Min. sensing object (opaque objects) Features E32-G14 10 mm (slot width)*1 (4-mm dia. min.) NT: 0.4-mm dia. NM: 0.7-mm dia. NV: 0.4-mm dia. NVG: 0.6-mm dia. Slot through-beam; no optical axis adjustment required *1 No-object teaching is not possible with the E32-G14 because the sensing distance of the E32-G14 is short and the light will be excessive. Perform with/without-object teaching instead. |
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