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SI5476DU Datasheet(PDF) 1 Page - Vishay Siliconix |
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SI5476DU Datasheet(HTML) 1 Page - Vishay Siliconix |
1 / 7 page FEATURES D TrenchFETr Power MOSFET D New Thermally Enhanced PowerPAKr ChipFET r Package – Small Footprint Area – Low On-Resistance – Thin 0.8-mm Profile APPLICATIONS D Load Switch for Portable Applications D DC–DC Switch for low power Synchronous Rectification D Intermediate Switch Driver for DC/DC Applications RoHS COMPLIANT Si5476DU Vishay Siliconix New Product Document Number: 73663 S–60219—Rev. A, 20-Feb-06 www.vishay.com 1 N-Channel 60-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) rDS(on) (W) ID (A)a Qg (Typ) 60 0.034 at VGS = 10 V 12 105nC 60 0.041 at VGS = 4.5 V 12 10.5 nC Marking Code AA XXX Lot Traceability and Date Code Part # Code Ordering Information: Si5476DU–T1–E3 (Lead (Pb)–free) Bottom View PowerPAK r ChipFETr Single D D D G 1 2 8 7 6 5 D D D S 3 4 S N-Channel MOSFET G D S ABSOLUTE MAXIMUM RATINGS (TA = 25 _C UNLESS OTHERWISE NOTED) Parameter Symbol Limit Unit Drain-Source Voltage VDS 60 V Gate-Source Voltage VGS " 20 V TC = 25 _C 12a Continuous Drain Current (TJ = 150 _C) TC = 70 _C ID 12a Continuous Drain Current (TJ = 150 _C) TA = 25 _C ID 7b, c TA = 70 _C 5.6b, c A Pulsed Drain Current IDM 25 A Continuous Source Drain Diode Current TC = 25 _C IS 12a Continuous Source-Drain Diode Current TA = 25 _C IS 2.6b, c Avalanche Current L=01mH IAS 15 Single Pulse Avalanche Energy L = 0.1 mH EAS 11.2 mJ TC = 25 _C 31 Maximum Power Dissipation TC = 70 _C PD 20 W Maximum Power Dissipation TA = 25 _C PD 3.1b, c W TA = 70 _C 2b, c Operating Junction and Storage Temperature Range TJ, Tstg – 55 to 150 _C Soldering Recommendations (Peak Temperature)d, e 260 _C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambientb, f t p 5 sec RthJA 34 40 _C/W Maximum Junction-to-Case (Drain) Steady State RthJC 3 4 _C/W Notes: a. Package limited. b. Surface Mounted on 1” x 1” FR4 Board. c. t = 5 sec. d. See Solder Profile (http://www.vishay.com/doc?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. f. Maximum under steady state conditions is 90 _C/W. |
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