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M29W400B-120ZA5R Datasheet(PDF) 7 Page - STMicroelectronics |
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M29W400B-120ZA5R Datasheet(HTML) 7 Page - STMicroelectronics |
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7 / 34 page  Output Enable (G). The Output Enable gates the outputs through the data buffers during a read operation. When G is High the outputs are High impedance. G must be forced to VID level during Block Protection and Unprotection operations. Write Enable (W). This input controls writing to the Command Register and Addressand Data latches. Byte/Word Organization Select (BYTE). The BYTE input selects the output configuration for the device: Byte-wide (x8) mode or Word-wide (x16) mode. When BYTE is Low, the Byte-wide mode is selected and the data is read and programmed on DQ0-DQ7. In this mode, DQ8-DQ14 are at high impedance and DQ15A–1 is the LSB address. When BYTE is High, the Word-wide mode is se- lected and the data is read and programmed on DQ0-DQ15. Ready/Busy Output (RB). Ready/Busy is an open-drain output and gives the internal state of the P/E.C. of the device. When RB is Low, the device is Busy with a Program or Erase operation and it will not accept any additional program or erase instructions except the Erase Suspend instruction. When RB is High, the device is ready for any Read, Program or Erase operation. The RB will also be High when the memory is put in Erase Suspend or Standby modes. Reset/Block Temporary Unprotect Input (RP). The RP Input provides hardware reset and pro- tected block(s) temporary unprotection functions. Reset of the memory is acheived by pulling RP to VIL for at least tPLPX. When the reset pulse is given, if the memory is in Read or Standby modes, it will be available for new operations in tPHEL after the rising edge of RP. If the memory is in Erase, Erase Suspend or Program modes the reset will take tPLYH during which the RB signal will be held at VIL. The end of the memory reset will be indicated by the rising edge of RB. A hardware reset during an Erase or Program operation will corrupt the data being programmed or the sector(s) being erased (see Table 14 and Figure 9). Temporary block unprotection is made by holding RP at VID. In this condition previously protected blocks can be programmed or erased. The transi- tion of RP from VIH to VID must slower than tPHPHH. When RP is returned from VID to VIH all blocks temporarily unprotected will be again protected. See Table 15 and Figure 9. VCC Supply Voltage. The power supply for all operations (Read, Program and Erase). VSS Ground. VSS is the reference for all voltage measurements. DEVICE OPERATIONS See Tables 4, 5 and 6. Read. Read operations are used to output the contents of the Memory Array, the Electronic Sig- nature, the Status Register or the Block Protection Status. Both Chip Enable E and Output Enable G must be low in order to read the output of the memory. Write. Writeoperationsare used to give Instruction Commands to the memory or to latch input data to be programmed. A write operation is initiated when Chip Enable E is Low and Write Enable W is Low with Output Enable G High. Addresses are latched on the falling edge of W or E whichever occurs last. Commands and Input Data are latchedon therising edge of W or E whichever occurs first. Output Disable. The data outputs are high imped- ance when the Output Enable G is High with Write Enable W High. Standby. The memory is in standby when Chip Enable E is High and the P/E.C. is idle. The power consumption is reduced to the standby level and the outputs are high impedance, independent of the Output Enable G or Write Enable W inputs. Automatic Standby. After 150ns of bus inactivity and when CMOS levels are driving the addresses, the chip automatically enters a pseudo-standby mode where consumption is reduced to the CMOS standby value, while outputs still drive the bus. Electronic Signature. Two codes identifying the manufacturer and the device can be read from the memory. The manufacturer ’s code for STMi- croelectronics is 20h, the device code is EEh for the M29W400T (Top Boot) and EFh for the M29W400B(Bottom Boot). These codes allow pro- gramming equipment or applications to automat- ically match their interface to the characteristics of the M29W400. The Electronic Signature is output by a Read operation when the voltage applied to A9 is at VID and address inputs A1 is Low. The manufacturer code is output when the Address input A0 is Low and the device code when this input is High. Other Address inputs are ignored. The codes are output on DQ0-DQ7. The Electronic Signature can also be read, without raising A9 to VID, by giving the memory the Instruc- tion AS. If the Byte-wide configuration is selected the codes are output on DQ0-DQ7 with DQ8-DQ14 at High impedance; if the Word-wide configuration is selected the codes are output on DQ0-DQ7 with DQ8-DQ15 at 00h. 7/34 M29W400T, M29W400B |
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