M48Z35, M48Z35Y

2/18

Figure 2A. DIP Pin Connections

A1

A0

DQ0

A7

A4

A3

A2

A6

A5

A13

A10

A8

A9

DQ7

W

A11

G

E

DQ5

DQ1

DQ2

DQ3

VSS

DQ4

DQ6

A12

A14

VCC

AI01617D

M48Z35

M48Z35Y

8

1

2

3

4

5

6

7

9

10

11

12

13

14

16

15

28

27

26

25

24

23

22

21

20

19

18

17

Note: 1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress

rating only and functional operation of the device at these or any other conditions above those indicated in the operational section

of this specification is not implied. Exposure to the absolute maximum rating conditions for extended periods of time may affect

reliability.

2. Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).

CAUTION: Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up mode.

CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.

Symbol

Parameter

Value

Unit

Ambient Operating Temperature

Grade 1

Grade 6

0 to 70

–40 to 85

°C

SNAPHAT

SOIC

–40 to 85

–55 to 125

°C

(2)

Lead Solder Temperature for 10 seconds

260

°C

Input or Output Voltages

–0.3 to 7

V

Supply Voltage

–0.3 to 7

V

Output Current

20

mA

Power Dissipation

1

W

Figure 2B. SOIC Pin Connections

AI02303C

8

2

3

4

5

6

7

9

10

11

12

13

14

22

21

20

19

18

17

16

15

28

27

26

25

24

23

1

A1

A0

DQ0

A7

A4

A3

A2

A6

A5

A13

A10

A8

A9

DQ7

W

A11

G

E

DQ5

DQ1

DQ2

DQ3

VSS

DQ4

DQ6

A12

A14

VCC

M48Z35Y