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M295V200BB55M6T Datasheet(PDF) 4 Page - STMicroelectronics |
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M295V200BB55M6T Datasheet(HTML) 4 Page - STMicroelectronics |
4 / 22 page M29F200BT, M29F200BB 4/22 Table 3A. M29F200BT Block Addresses Size (Kbytes) Address Range (x8) Address Range (x16) 16 3C000h-3FFFFh 1E000h-1FFFFh 8 3A000h-3BFFFh 1D000h-1DFFFh 8 38000h-39FFFh 1C000h-1CFFFh 32 30000h-37FFFh 18000h-1BFFFh 64 20000h-2FFFFh 10000h-17FFFh 64 10000h-1FFFFh 08000h-0FFFFh 64 00000h-0FFFFh 00000h-07FFFh Reset/Block Temporary Unprotect (RP). The Re- set/Block Temporary Unprotect pin can be used to apply a Hardware Reset to the memory or to tem- porarily unprotect all Blocks that have been pro- tected. A Hardware Reset is achieved by holding Reset/ Block Temporary Unprotect Low, VIL, for at least tPLPX. After Reset/Block temporary unprotect goes High, VIH, the memory will be ready for Bus Read and Bus Write operations after tPHEL or tRHEL, whichever occurs last. See the Ready/Busy Out- put section, Table 14 and Figure 10, Reset/Tem- porary Unprotect AC Characteristics for more details. Holding RP at VID will temporarily unprotect the protected Blocks in the memory. Program and Erase operations on all blocks will be possible. The transition from VIH to VID must be slower than tPHPHH. Ready/Busy Output (RB). The Ready/Busy pin is an open-drain output that can be used to identify when the memory array can be read. Ready/Busy is high-impedance during Read mode, Auto Select mode and Erase Suspend mode. After a Hardware Reset, Bus Read and Bus Write operations cannot begin until Ready/Busy be- comes high-impedance. See Table 14 and Figure 10, Reset/Temporary Unprotect AC Characteris- tics. During Program or Erase operations Ready/Busy is Low, VOL. Ready/Busy will remain Low during Table 3B. M29F200BB Block Addresses Size (Kbytes) Address Range (x8) Address Range (x16) 64 30000h-3FFFFh 18000h-1FFFFh 64 20000h-2FFFFh 10000h-17FFFh 64 10000h-1FFFFh 08000h-0FFFFh 32 08000h-0FFFFh 04000h-07FFFh 8 06000h-07FFFh 03000h-03FFFh 8 04000h-05FFFh 02000h-02FFFh 16 00000h-03FFFh 00000h-01FFFh Read/Reset commands or Hardware Resets until the memory is ready to enter Read mode. The use of an open-drain output allows the Ready/ Busy pins from several memories to be connected to a single pull-up resistor. A Low will then indicate that one, or more, of the memories is busy. Byte/Word Organization Select (BYTE). The Byte/ Word Organization Select pin is used to switch be- tween the 8-bit and 16-bit Bus modes of the mem- ory. When Byte/Word Organization Select is Low, VIL, the memory is in 8-bit mode, when it is High, VIH, the memory is in 16-bit mode. VCC Supply Voltage. The VCC Supply Voltage supplies the power for all operations (Read, Pro- gram, Erase etc.). The Command Interface is disabled when the VCC Supply Voltage is less than the Lockout Voltage, VLKO. This prevents Bus Write operations from ac- cidentally damaging the data during power up, power down and power surges. If the Program/ Erase Controller is programming or erasing during this time then the operation aborts and the memo- ry contents being altered will be invalid. A 0.1 µF capacitor should be connected between the VCC Supply Voltage pin and the VSS Ground pin to decouple the current surges from the power supply. The PCB track widths must be sufficient to carry the currents required during program and erase operations, ICC4. Vss Ground. The VSS Ground is the reference for all voltage measurements. |
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