Technical Data Sheet

High Power Lamp

Preliminary

EHP-1103/UY01-P01

Everlight Electronics Co., Ltd.

http\\:www.everlight.com

Rev :

Page: 8 of 8

Device Number :

Prepared date:11-30-2006

Prepared by: Shaohsulu

6. If the emitter is operated, consider using metal heat sink with the lowest possible thermal

resistance. For the thermal performance using a flat heat sink, allow an exposed surface area of

about 25mm

7. Soldering Condition

Careful attention should be paid during soldering. When soldering, leave more then 3mm

from solder joint to case, and soldering beyond the base of the tie bar is recommended.

Avoiding applying any stress to the lead frame while the LEDs are at high temperature

particularly when soldering.

Recommended soldering conditions:

Hand Soldering

DIP Soldering

Temp. at tip of iron

400

Max.

℃

(30W

Max.)

Preheat temp.

100

Max.

℃

(60 sec Max.)

Soldering time

3 sec Max.

Bath temp.

265 Max.

Distance

3mm Min.(From solder

joint to case)

Bath time.

5 sec Max.

Distance

3mm Min.

EVERLIGHT ELECTRONICS CO., LTD.

Tel: 886-2-2267-2000, 2267-9936

Office: No 25, Lane 76, Sec 3, Chung Yang Rd,

Fax: 886-2267-6244, 2267-6189, 2267-6306

Tucheng, Taipei 236, Taiwan, R.O.C

http:\\www.everlight.com