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HIR5393C Datasheet(PDF) 8 Page - Everlight Electronics Co., Ltd |
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HIR5393C Datasheet(HTML) 8 Page - Everlight Electronics Co., Ltd |
8 / 8 page Everlight Electronics Co., Ltd. http:\\www.everlight.com Rev 3 Page: 8 of 8 Device No :DIH-539-096 Prepared date :12-28-2007 Prepared by :Jaine Tsai HIR5393C/L223 5. Soldering Condition Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to case, and soldering beyond the base of the tie bar is recommended. Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering. Recommended soldering conditions: Hand Soldering DIP Soldering Temp. at tip of iron 400 Max. ℃ (30W Max.) Preheat temp. 100 Max. ℃ (60 sec Max.) Soldering time 3 sec Max. Bath temp. 265 Max. Distance 3mm Min.(From solder joint to case) Bath time. 5 sec Max. Distance 3mm Min. EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936 Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306 Tucheng, Taipei 236, Taiwan, R.O.C http:\\www.everlight.com |
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