Vicor Corp. Tel: 800-735-6200, 978-470-2900 Fax: 978-475-6715

24Vin/48Vout/200W DC-DC Converter

Rev. 5.2

Page 1 of 9

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Parameter

Rating

Unit

Notes

+In to –In voltage

-0.5 to +36.0

Vdc

+In to –In voltage

55

Vdc

<100ms

PC to –In voltage

-0.5 to +7.0

Vdc

PR to –In voltage

-0.5 to +7.0

Vdc

+Out to –Out voltage

-0.5 to +62.9

Vdc

+Sense to –Out voltage

-0.5 to +62.9

Vdc

–Sense to –Out voltage

1.0

Vdc

SC to –Out voltage

-0.5 to +1.5

Vdc

Isolation voltage (in to out)

3000

Vrms

Isolation voltage (in to base)

1550

Vrms

Isolation voltage (out to base)

500

Vrms

Storage temperature

See Page 8

°C

125 Max

Operating temperature

See Page 8

°C

Baseplate

Pin soldering temperature

500 (260)

°F (°C)

<5 sec; wave solder

Pin soldering temperature

750 (390)

°F (°C)

<7 sec; hand solder

Mounting torque

5 (0.57)

in-lbs (N-m)

6 each, # 4-40 or M3

Shown actual size:

2.28 x 2.2 x 0.5 in

57,9 x 55,9 x 12,7 mm

(Product shown is for size only.

Pin and baseplate style may vary.

Pin style 1 and slotted baseplate are shown.)

Absolute Maximum Ratings

Parameter

Min

Typ

Max

Unit

Baseplate to sink; flat, greased surface

0.16

°C/Watt

Baseplate to sink; thermal pad (P/N 20264)

0.14

°C/Watt

Baseplate to ambient

8.0

°C/Watt

Baseplate to ambient; 1000 LFM

1.9

°C/Watt

Thermal capacity

83

Watt-sec/°C

Thermal Resistance and Capacity

24Vin / 48Vout / 200Watts

DC-DC Converter Module

See Page 8 for Part Numbering and Options

Features

• DC input range: 18 - 36V

• Input surge withstand: 55V for 100ms

• DC output: 48V

• Programmable output: 10 to 110%

• Regulation: ±0.5% no load to full load

• Efficiency: 88%

• Maximum operating temperature:

100°C at full load

• Power density: 79W/cubic inch

• Height above board: 0.43 in. (10,9 mm)

• Parallelable, with N+M fault tolerance

• Low noise ZCS/ZVS architecture

• Pin style: See Page 6

• Baseplate: See Page 7

Product Overview

This DC-DC converter module uses

2nd Generation power processing, control

and packaging technologies to provide the

performance, flexibility and cost effectiveness

expected of a mature power component.

For example, a plated-cavity core transformer

couples widely separated primary and

secondary windings, resulting in low in-to-

out parasitic capacitance and noise.

High frequency ZCS/ZVS switching,

advanced power semiconductor packaging

and thermal management provide high

power density with low temperature

gradients. Extensive use of silicon

integration results in 1/3 the part count

of a 1st Generation converter.

This converter is manufactured in a

state-of-the-art automated manufacturing

facility on a short-cycle-time robotic line

having a capacity of one module every ten

seconds. In-line process controls are

designed to achieve low defect rates and

consistent quality. A comprehensive CIM

system controls the dispatching, assembly

and testing of each module, enabling small

lots to be manufactured as efficiently as

hundreds-of-thousands of units.