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K4X56163P-L Datasheet(PDF) 11 Page - Samsung semiconductor |
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K4X56163P-L Datasheet(HTML) 11 Page - Samsung semiconductor |
11 / 20 page K4X56163PI - L(F)E/G - 14 - Mobile DDR SDRAM October 2007 12. DC CHARACTERISTICS Recommended operating conditions (Voltage referenced to VSS = 0V, Tc = -25 to 85 °C) NOTE : 1) It has +/- 5 °C tolerance. 2) DPD(Deep Power Down) function is an optional feature, and it will be enabled upon request. Please contact Samsung for more information. 3) IDD specifications are tested after the device is properly intialized. 4) Input slew rate is 1V/ns. 5) Definitions for IDD: LOW is defined as VIN ≤ 0.1 * VDDQ ; HIGH is defined as VIN ≥ 0.9 * VDDQ ; STABLE is defined as inputs stable at a HIGH or LOW level ; SWITCHING is defined as: - address and command: inputs changing between HIGH and LOW once per two clock cycles ; - data bus inputs: DQ changing between HIGH and LOW once per clock cycle; DM and DQS are STABLE. Parameter Symbol Test Condition DDR333 DDR266 Unit Note Operating Current (One Bank Active) IDD0 tRC=tRCmin; tCK=tCKmin; CKE is HIGH; CS is HIGH between valid com- mands; address inputs are SWITCHING; data bus inputs are STABLE 50 45 mA Precharge Standby Current in power-down mode IDD2P all banks idle, CKE is LOW; CS is HIGH, tCK = tCKmin; address and control inputs are SWITCHING; data bus inputs are STABLE 0.3 mA IDD2PS all banks idle, CKE is LOW; CS is HIGH, CK = LOW, CK = HIGH; address and control inputs are SWITCHING; data bus inputs are STABLE 0.3 Precharge Standby Current in non power-down mode IDD2N all banks idle, CKE is HIGH; CS is HIGH, tCK = tCKmin; address and control inputs are SWITCHING; data bus inputs are STABLE 15 12 mA IDD2NS all banks idle, CKE is HIGH; CS is HIGH, CK = LOW, CK = HIGH; address and control inputs are SWITCHING; data bus inputs are STABLE 8 8 Active Standby Current in power-down mode IDD3P one bank active, CKE is LOW; CS is HIGH, tCK = tCKmin; address and control inputs are SWITCHING; data bus inputs are STABLE 5 mA IDD3PS one bank active, CKE is LOW; CS is HIGH, CK = LOW, CK = HIGH; address and control inputs are SWITCHING; data bus inputs are STABLE 2 Active Standby Current in non power-down mode (One Bank Active) IDD3N one bank active, CKE is HIGH; CS is HIGH, tCK = tCKmin; address and control inputs are SWITCHING; data bus inputs are STABLE 25 25 mA IDD3NS one bank active, CKE is HIGH; CS is HIGH, CK = LOW, CK = HIGH; address and control inputs are SWITCHING; data bus inputs are STABLE 20 20 Operating Current (Burst Mode) IDD4R one bank active; BL=4; CL=3; tCK = tCKmin; continuous read bursts; I OUT =0 mA; address inputs are SWITCHING; 50% data change each burst transfer 110 95 mA IDD4W one bank active; BL = 4; tCK = tCKmin ; continuous write bursts; address inputs are SWITCHING; 50% data change each burst transfer 90 75 Refresh Current IDD5 tRC = tRFCmin ; tCK = tCKmin ; burst refresh; CKE is HIGH; address and control inputs are SWITCHING; data bus inputs are STABLE 100 85 mA Self Refresh Current IDD6 CKE is LOW; t CK = t CKmin ; Extended Mode Register set to all 0’s; address and control inputs are STABLE; data bus inputs are STABLE Parameter 451) 85 °C - E Full Array 200 450 uA 1/2 Array 160 300 1/4 Array 140 250 - G Full Array 150 300 1/2 Array 135 250 1/4 Array 130 225 Deep Power Down Current IDD8 Deep Power Down Mode Current 10 uA 2 |
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