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K4X56163P-L Datasheet(PDF) 11 Page - Samsung semiconductor

Part # K4X56163P-L
Description  16Mx16 Mobile DDR SDRAM
Download  20 Pages
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

K4X56163P-L Datasheet(HTML) 11 Page - Samsung semiconductor

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K4X56163PI - L(F)E/G
- 14 -
Mobile DDR SDRAM
October 2007
12. DC CHARACTERISTICS
Recommended operating conditions (Voltage referenced to VSS = 0V, Tc = -25 to 85
°C)
NOTE :
1) It has +/- 5
°C tolerance.
2) DPD(Deep Power Down) function is an optional feature, and it will be enabled upon request.
Please contact Samsung for more information.
3) IDD specifications are tested after the device is properly intialized.
4) Input slew rate is 1V/ns.
5) Definitions for IDD: LOW is defined as VIN
≤ 0.1 * VDDQ ;
HIGH is defined as VIN
≥ 0.9 * VDDQ ;
STABLE is defined as inputs stable at a HIGH or LOW level ;
SWITCHING is defined as: - address and command: inputs changing between HIGH and LOW once per two clock cycles ;
- data bus inputs: DQ changing between HIGH and LOW once per clock cycle; DM and DQS are STABLE.
Parameter
Symbol
Test Condition
DDR333 DDR266 Unit Note
Operating Current
(One Bank Active)
IDD0
tRC=tRCmin; tCK=tCKmin; CKE is HIGH; CS is HIGH between valid com-
mands; address inputs are SWITCHING; data bus inputs are STABLE
50
45
mA
Precharge Standby Current
in power-down mode
IDD2P
all banks idle, CKE is LOW; CS is HIGH, tCK = tCKmin;
address and control inputs are SWITCHING; data bus inputs are STABLE
0.3
mA
IDD2PS
all banks idle, CKE is LOW; CS is HIGH, CK = LOW, CK = HIGH;
address and control inputs are SWITCHING; data bus inputs are STABLE
0.3
Precharge Standby Current
in non power-down mode
IDD2N
all banks idle, CKE is HIGH; CS is HIGH, tCK = tCKmin;
address and control inputs are SWITCHING; data bus inputs are STABLE
15
12
mA
IDD2NS
all banks idle, CKE is HIGH; CS is HIGH, CK = LOW, CK = HIGH;
address and control inputs are SWITCHING; data bus inputs are STABLE
8
8
Active Standby Current
in power-down mode
IDD3P
one bank active, CKE is LOW; CS is HIGH, tCK = tCKmin;
address and control inputs are SWITCHING; data bus inputs are STABLE
5
mA
IDD3PS
one bank active, CKE is LOW; CS is HIGH, CK = LOW, CK = HIGH;
address and control inputs are SWITCHING; data bus inputs are STABLE
2
Active Standby Current
in non power-down mode
(One Bank Active)
IDD3N
one bank active, CKE is HIGH; CS is HIGH, tCK = tCKmin;
address and control inputs are SWITCHING; data bus inputs are STABLE
25
25
mA
IDD3NS
one bank active, CKE is HIGH; CS is HIGH, CK = LOW, CK = HIGH;
address and control inputs are SWITCHING; data bus inputs are STABLE
20
20
Operating Current
(Burst Mode)
IDD4R
one bank active; BL=4; CL=3; tCK = tCKmin; continuous read bursts;
I OUT =0 mA;
address inputs are SWITCHING; 50% data change each burst transfer
110
95
mA
IDD4W
one bank active; BL = 4; tCK = tCKmin ; continuous write bursts;
address inputs are SWITCHING; 50% data change each burst transfer
90
75
Refresh Current
IDD5
tRC = tRFCmin ; tCK = tCKmin ; burst refresh; CKE is HIGH;
address and control inputs are SWITCHING; data bus inputs are STABLE
100
85
mA
Self Refresh Current
IDD6
CKE is LOW; t CK = t CKmin ;
Extended Mode Register set to all 0’s;
address and control inputs are STABLE;
data bus inputs are STABLE
Parameter
451)
85
°C
- E
Full Array
200
450
uA
1/2 Array
160
300
1/4 Array
140
250
- G
Full Array
150
300
1/2 Array
135
250
1/4 Array
130
225
Deep Power Down Current
IDD8
Deep Power Down Mode Current
10
uA
2


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