LUXEON Emitter DS25 (5/07)

7

Absolute Maximum Ratings

Table 5.

W

Wh

hiitte

e//G

Grre

ee

en

n//

R

Re

ed

d//

C

Cy

ya

an

n//B

Bllu

ue

e//

W

Wa

arrm

m

R

Re

ed

d O

Orra

an

ng

ge

e//

P

Pa

arra

am

me

ette

err

R

Ro

oy

ya

all B

Bllu

ue

e

W

Wh

hiitte

e

A

Am

mb

be

err

DC Forward Current (mA)

[1]

350

350

385

Peak Pulsed Forward Current (mA)

500

500

550

Average Forward Current (mA)

350

350

350

ESD Sensitivity

[2]

± 16,000V HBM

LED Junction Temperature (°C)

135

120

120

Storage Temperature (°C)

40 to +120

40 to +120

40 to +120

Soldering Temperature (°C)

[3]

260 for 5

260 for 5

260 for 5

seconds max

seconds max

seconds max

Notes for Table 5:

1.

Proper current derating must be observed to maintain junction temperature below the maximum. For more information,

consult the LUXEON Design Guide, available upon request.

2.

LEDs are not designed to be driven in reverse bias. Please consult Philips Lumileds' Application Brief AB11 for further

information.

3.

Measured at leads, during lead soldering and slug attach, body temperature must not exceed 120°C. LUXEON emitters

cannot be soldered by general IR or Vaporphase reflow, nor by wave soldering. Lead soldering is limited to selective

heating of the leads, such as by hotbar reflow, fiber focussed IR, or hand soldering. The package back plane (slug) may

not be attached by soldering, but rather with a thermally conductive adhesive. Electrical insulation between the slug and

the board is required. Please consult Philips Lumileds' Application Brief AB10 on LUXEON Emitter Assembly Information

for further details on assembly methods.