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OMAP3503 Datasheet(PDF) 3 Page - Texas Instruments |
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OMAP3503 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 227 page www.ti.com 1.2 Description OMAP3515/03 Applications Processor SPRS505 – FEBRUARY 2008 OMAP3515 and OMAP3503 high-performance, applications processors are based on the enhanced OMAP™ 3 architecture. The OMAP™ 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following: • Streaming video • 2D/3D mobile gaming • Video conferencing • High-resolution still image • Video capture in 2.5G wireless terminals, 3G wireless terminals, and rich multimedia-featured handsets, and high-performance personal digital assistants (PDAs). The device supports high-level operating systems (OSs), such as: • Windows CE • Symbian OS • Linux • Palm OS This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products. The following subsystems are part of the device: • Microprocessor unit (MPU) subsystem based on the ARM Cortex™-A8 microprocessor • SGX530 subsystem for 2D and 3D graphics acceleration to support display and gaming effects (3515only) • Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out. • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals The device also offers: • A comprehensive power and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex™ adaptative voltage control. This power management technique for automatic control of the operating voltage of a module reduces the active power consumption. • Memory stacking feature using the package-on-package (POP) implementation (CBB package only) OMAP3515/03 devices are available in a 515-pin PBGA package (CBB suffix) and a 423-pin PBGA package (CUS suffix). Some features of the CBB package are not available in the CUS package. Table 1-1 lists the differences between the CBB and CUS packages. Submit Documentation Feedback OMAP3515/03 Applications Processor 3 |
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