DMOS Microstepping Driver with Translator

A3983

11

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-5000

www.allegromicro.com

LP Package, 24-Pin TSSOP with Exposed Thermal Pad

1.20 MAX

C

SEATING

PLANE

0.15 MAX

C

0.10

24X

0.65

6.10

3.00

4.32

1.65

0.45

0.65

0.25

2

1

24

3.00

4.32

(1.00)

GAUGE PLANE

SEATING PLANE

B

A

A Terminal #1 mark area

B

For reference only

(reference JEDEC MO-153 ADT)

Dimensions in millimeters

Dimensions exclusive of mold flash, gate burrs, and dambar protrusions

Exact case and lead configuration at supplier discretion within limits shown

Reference land pattern layout (reference IPC7351

TSOP65P640X120-25M); all pads a minimum of 0.20 mm from all

adjacent pads; adjust as necessary to meet application process

requirements and PCB layout tolerances; when mounting on a multilayer

PCB, thermal vias at the exposed thermal pad land can improve thermal

dissipation (reference EIA/JEDEC Standard JESD51-5)

PCB Layout Reference View

Exposed thermal pad (bottom surface)

C

C

7.80 ±0.10

4.40 ±0.10

6.40 ±0.20

0.60 ±0.15

4° ±4

0.25 +0.05

–0.06

0.15 +0.05

–0.06

Copyright ©2005-2008, Allegro MicroSystems, Inc.

The products described here are manufactured under one or more U.S. patents or U.S. patents pending.

Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to per-

mit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the

information being relied upon is current.

Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the

failure of that life support device or system, or to affect the safety or effectiveness of that device or system.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use;

nor for any infringement of patents or other rights of third parties which may result from its use.

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