LUXEON Rebel Datasheet DS56 (7/07)

9

Reflow Soldering Characteristics

Table 7.

P

Prro

offiille

e F

Fe

ea

attu

urre

e

L

Le

ea

ad

d F

Frre

ee

e A

As

ss

se

em

mb

blly

y

3°C / second max

150°C

200°C

60

180 seconds

217°C

60

150 seconds

260°C

20

40 seconds

Ramp

Down Rate

6°C / second max

Time 25°C to Peak Temperature

8 minutes max

Notes for Table 7:

1.

All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the

package body.

JEDEC 020c