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CY7C1387CV25-200BGC Datasheet(PDF) 7 Page - Cypress Semiconductor

Part # CY7C1387CV25-200BGC
Description  18-Mb (512K x 36/1M x 18) Pipelined DCD Sync SRAM
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1387CV25-200BGC Datasheet(HTML) 7 Page - Cypress Semiconductor

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CY7C1386CV25
CY7C1387CV25
Document #: 38-05242 Rev. *A
Page 7 of 36
ADSC
85
B4
A8
Input-
Synchronous
Address Strobe from Controller, sampled on the
rising edge of CLK, active LOW. When asserted LOW,
addresses presented to the device are captured in the
address registers. A1: A0 are also loaded into the burst
counter. When ADSP and ADSC are both asserted, only
ADSP is recognized.
ZZ
64
T7
H11
Input-
Asynchronous
ZZ “sleep” Input, active HIGH. When asserted HIGH
places the device in a non-time-critical “sleep” condition
with data integrity preserved. For normal operation, this
pin has to be LOW or left floating. ZZ pin has an internal
pull-down.
DQs, DQPs 52,53,56,57,
58,59,62,63,
68,69,72,73,
74,75,78,79,
2,3,6,7,8,9,
12,13,18,19,
22,23,24,25,
28,29,51,80,
1,30
K6,L6,M6,
N6,K7,L7,
N7,P7,E6,
F6,G6,H6,
D7,E7,G7,
H7,D1,E1,
G1,H1,E2,
F2,G2,H2,
K1,L1,N1,
P1,K2,L2,
M2,N2,P6,
D6,D2,P2
M11,L11,K11,
J11,J10,K10,
L10,M10,D10
,E10,F10,G10
,D11,E11,F11,
G11,D1,E1,
F1,G1,D2,E2,
F2,G2,J1,K1,
L1,M1,J2,K2,
L2,M2,N11,
C11,C1,N1
I/O-
Synchronous
Bidirectional Data I/O lines. As inputs, they feed into
an on-chip data register that is triggered by the rising
edge of CLK. As outputs, they deliver the data contained
in the memory location specified by the addresses
presented during the previous clock rise of the read
cycle. The direction of the pins is controlled by OE.
When OE is asserted LOW, the pins behave as outputs.
When HIGH, DQs and DQPX are placed in a tri-state
condition.
VDD
15,41,65,91 J2,C4,J4,
R4,J6
D4,D8,E4,E8,
F4,F8,G4,G8,
H4,H8,J4,J8,
K4,K8,L4,L8,
M4,M8
Power Supply Power supply inputs to the core of the device.
VSS
17,40,67,90 D3,E3,F3,
H3,K3,M3,
N3,P3,D5,
E5,F5,H5,
K5,M5,N5,
P5
C4,C5,C6,C7,
C8,D5,D6,D7,
E5,E6,E7,F5,
F6,F7,G5,G6,
G7,H2,H5,H6
,H7,J5,J6,J7,
K5,K6,K7,L5,
L6,L7,M5,M6,
M7,N4,N8
Ground
Ground for the core of the device.
VSSQ
5,10,21,26,
55,60,71,76
-
-
I/O Ground
Ground for the I/O circuitry.
VDDQ
4,11,20,27,
54,61,70,77
A1,F1,J1,
M1,U1,A7,
F7,J7,M7,
U7
C3,C9,D3,D9,
E3,E9,F3,F9,
G3,G9,J3,J9,
K3,K9,L3,L9,
M3,M9,N3,N9
I/O Power Sup-
ply
Power supply for the I/O circuitry.
MODE
31
R3
R1
Input-
Static
Selects Burst Order. When tied to GND selects linear
burst sequence. When tied to VDD or left floating selects
interleaved burst sequence. This is a strap pin and
should remain static during device operation. Mode Pin
has an internal pull-up.
TDO
-
U5
P7
JTAG serial
output
Synchronous
Serial data-out to the JTAG circuit. Delivers data on
the negative edge of TCK. If the JTAG feature is not
being utilized, this pin should be disconnected. This pin
is not available on TQFP packages.
CY7C1386CV25–Pin Definitions (continued)
Name
TQFP
BGA
(1 Chip
Enable)
fBGA
I/O
Description


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