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CY7C1420BV18-267BZXC Datasheet(PDF) 9 Page - Cypress Semiconductor

Part # CY7C1420BV18-267BZXC
Description  36-Mbit DDR-II SRAM 2-Word Burst Architecture
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1420BV18-267BZXC Datasheet(HTML) 9 Page - Cypress Semiconductor

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CY7C1416BV18, CY7C1427BV18
CY7C1418BV18, CY7C1420BV18
Document Number: 001-07033 Rev. *C
Page 9 of 29
Depth Expansion
Depth expansion requires replicating the LD control signal for
each bank. All other control signals can be common between
banks as appropriate.
Programmable Impedance
An external resistor, RQ, must be connected between the ZQ pin
on the SRAM and VSS to allow the SRAM to adjust its output
driver impedance. The value of RQ must be 5x the value of the
intended line impedance driven by the SRAM, The allowable
range of RQ to guarantee impedance matching with a tolerance
of ± 15% is between 175
Ω and 350Ω, with V
DDQ =1.5V. The
output impedance is adjusted every 1024 cycles upon power up
to account for drifts in supply voltage and temperature.
Echo Clocks
Echo clocks are provided on the DDR-II to simplify data capture
on high-speed systems. Two echo clocks are generated by the
DDR-II. CQ is referenced with respect to C and CQ is referenced
with respect to C. These are free-running clocks and are
synchronized to the output clock of the DDR-II. In the single clock
mode, CQ is generated with respect to K, and CQ is generated
with respect to K. The timings for the echo clocks is shown in the
AC Timing Table.
DLL
These chips use a Delay Lock Loop (DLL) that is designed to
function between 120 MHz and the specified maximum clock
frequency. During power up, when the DOFF is tied HIGH, the
DLL is locked after 1024 cycles of stable clock. The DLL can also
be reset by slowing or stopping the input clock K and K for a
minimum of 30 ns. However, it is not necessary to reset the DLL
to lock to the desired frequency. The DLL automatically locks
1024 clock cycles after a stable clock is presented. The DLL may
be disabled by applying ground to the DOFF pin. When the DLL
is turned off, the device behaves in DDR-I mode (with one cycle
latency and a longer access time). For information refer to the
application note “DLL Considerations in QDRII™/DDRII”.
Application Example
Figure 1 shows two DDR-II used in an application.
Figure 1. Application Example
Vterm = 0.75V
Vterm = 0.75V
R = 50
ohms
R = 250
ohms
LD#
C C#
R/W#
DQ
A
K
LD#
C C#
R/W#
DQ
A
K
SRAM#1
SRAM#2
R
= 250ohms
BUS
MASTER
(CPU
or
ASIC)
DQ
Addresses
Cycle Start#
R/W#
Return CLK
Source CLK
Return CLK#
Source CLK#
Echo Clock1/Echo Clock#1
Echo Clock2/Echo Clock#2
ZQ
CQ/CQ#
K#
ZQ
CQ/CQ#
K#
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