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CY7C1311CV18-167BZXI Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # CY7C1311CV18-167BZXI
Description  18-Mbit QDR??II SRAM 4-Word Burst Architecture
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1311CV18-167BZXI Datasheet(HTML) 1 Page - Cypress Semiconductor

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18-Mbit QDR™-II SRAM 4-Word
Burst Architecture
CY7C1311CV18, CY7C1911CV18
CY7C1313CV18, CY7C1315CV18
Cypress Semiconductor Corporation
198 Champion Court
San Jose
, CA 95134-1709
408-943-2600
Document Number: 001-07165 Rev. *C
Revised September 26, 2007
Features
Separate independent read and write data ports
Supports concurrent transactions
300 MHz clock for high bandwidth
4-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 600 MHz) at 300 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
QDR™-II operates with 1.5 cycle read latency when the Delay
Lock Loop (DLL) is enabled
Operates as a QDR-I device with 1 cycle read latency in DLL
off mode
Available in x 8, x 9, x 18, and x 36 configurations
Full data coherency, providing most current data
Core VDD = 1.8 (±0.1V); IO VDDQ = 1.4V to VDD
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1311CV18 – 2M x 8
CY7C1911CV18 – 2M x 9
CY7C1313CV18 – 1M x 18
CY7C1315CV18 – 512K x 36
Functional Description
The CY7C1311CV18, CY7C1911CV18, CY7C1313CV18, and
CY7C1315CV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II architecture. QDR-II architecture
consists of two separate ports: the read port and the write port to
access the memory array. The read port has dedicated data
outputs to support read operations and the write port has
dedicated data inputs to support write operations. QDR-II
architecture has separate data inputs and data outputs to
completely eliminate the need to “turn-around” the data bus
required with common IO devices. Access to each port is
accomplished through a common address bus. Addresses for
read and write addresses are latched on alternate rising edges
of the input (K) clock. Accesses to the QDR-II read and write
ports are completely independent of one another. In order to
maximize data throughput, both read and write ports are
provided with DDR interfaces. Each address location is
associated with four 8-bit words (CY7C1311CV18) or 9-bit words
(CY7C1911CV18) or 18-bit words (CY7C1313CV18) or 36-bit
words (CY7C1315CV18) that burst sequentially into or out of the
device. Because data can be transferred into and out of the
device on every rising edge of both input clocks (K and K and C
and C), memory bandwidth is maximized while simplifying
system design by eliminating bus “turn-arounds”.
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
Selection Guide
300 MHz
278 MHz
250 MHz
200 MHz
167 MHz
Unit
Maximum Operating Frequency
300
278
250
200
167
MHz
Maximum Operating Current
x8
765
720
665
560
495
mA
x9
800
730
675
570
490
x18
840
760
705
590
505
x36
985
910
830
675
570
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