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COMLINK™ SERIES
CY2CC910
Document #: 38-07348 Rev. *B
Page 8 of 9
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Package Drawing and Dimensions
VOI is a trademark of Cypress Semiconductor. All product and company names mentioned in this document are the trademarks
of their respective holders.
PIN1ID
SEATING PLANE
0.497[12.623]
0.513[13.030]
1
10
11
20
*
*
*
DIMENSIONS IN INCHES [MM]
MIN.
MAX.
0.291[7.391]
0.300[7.620]
0.394[10.007]
0.419[10.642]
0.050[1.270]
TYP.
0.092[2.336]
0.105[2.667]
0.004[0.101]
0.0118[0.299]
0.0091[0.231]
0.0125[0.317]
0.015[0.381]
0.050[1.270]
0.013[0.330]
0.019[0.482]
0.026[0.660]
0.032[0.812]
0.004[0.101]
REFERENCE JEDEC MO-119
PART #
S20.3 STANDARD PKG.
SZ20.3 LEAD FREE PKG.
PACKAGE WEIGHT 0.55 gms
51-85024-*B
20-Lead (300-Mil) SOIC S5
51-85077-*C
20-pin Shrunk Small Outline Package O20
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